The performances of various transverse-flow double-layer microchannel heat sink configurations were evaluated compared to those of parallel-flow heat sink configurations via conjugate heat transfer analysis. For the analysis, three-dimensional Navier–Stokes and energy equations for steady incompressible laminar flow were solved using a finite-volume solver. Water with temperature-dependent thermophysical properties was used as a coolant. The thermal resistances were evaluated for various flow configurations of both cross-channel and parallel-channel designs with identical geometric parameters and total flow rate. Changes in the microchannel flow direction lead to remarkable changes in thermal resistance and temperature uniformity. A transverse-flow configuration exhibited the best overall performance among the tested flow configurations in terms of the thermal resistance, temperature uniformity, and pressure drop.
Double-Layer Microchannel Heat Sinks With Transverse-Flow Configurations
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received February 24, 2016; final manuscript received May 1, 2016; published online May 19, 2016. Assoc. Editor: Xiaobing Luo.
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Ansari, D., and Kim, K. (May 19, 2016). "Double-Layer Microchannel Heat Sinks With Transverse-Flow Configurations." ASME. J. Electron. Packag. September 2016; 138(3): 031005. https://doi.org/10.1115/1.4033558
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