It is important to control the skin temperatures of smartphones, tablets, and wearable electronics. The comfort levels of the skin temperatures are determined by surveys with subjective evaluations on a limited number of configurations and/or materials. This study is the first attempt to develop a characterization tool that is objective, repeatable, and predictable. The first step is to apply a gel finger that replaces the human finger to measure temperatures after gel finger's contact with the skin, i.e., the case of a mobile system. The second step is to establish a model calibrated by the experimental results. The calibrated model can be used to simulate different effects on the temperatures at the interface between the gel finger and the skin. The temperatures of the polycarbonate skin “felt” by the gel finger are always lower than those of the aluminum skin. The difference could reach 2–6 °C depending on heat spreading inside the system and heat sources in the finger. The difference can be reduced from 6 to 3 °C by using a novel casing with thin film metal on polymer. The transient periods are approximately 100–200 s with shorter transient periods for the aluminum skin.
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September 2016
Research-Article
Use of a Gel Finger to Feel the Skin Temperatures of a Smartphone
Akshay Sripada,
Akshay Sripada
Department of Mechanical Engineering,
University of Colorado at Boulder,
Boulder, CO 80309
e-mail: akshay.sripada@colorado.edu
University of Colorado at Boulder,
Boulder, CO 80309
e-mail: akshay.sripada@colorado.edu
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Morgan Rohlfing,
Morgan Rohlfing
Department of Mechanical Engineering,
University of Colorado at Boulder,
Boulder, CO 80309
e-mail: morgan.rohlfing@gmail.com
University of Colorado at Boulder,
Boulder, CO 80309
e-mail: morgan.rohlfing@gmail.com
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Raymond Vijaendreh,
Raymond Vijaendreh
Department of Mechanical Engineering,
University of Colorado at Boulder,
Boulder, CO 80309
e-mail: vijaendrehraymond@gmail.com
University of Colorado at Boulder,
Boulder, CO 80309
e-mail: vijaendrehraymond@gmail.com
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Brenden Spetzler,
Brenden Spetzler
Department of Mechanical Engineering,
University of Colorado at Boulder,
Boulder, CO 80309
e-mail: spetzleb@colorado.edu
University of Colorado at Boulder,
Boulder, CO 80309
e-mail: spetzleb@colorado.edu
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Ramsey Abdulhamid,
Ramsey Abdulhamid
Department of Mechanical Engineering,
University of Colorado at Boulder,
Boulder, CO 80309
e-mail: ramsey.abdulhamid@gmail.com
University of Colorado at Boulder,
Boulder, CO 80309
e-mail: ramsey.abdulhamid@gmail.com
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Aaron Porras,
Aaron Porras
Department of Mechanical Engineering,
University of Colorado at Boulder,
Boulder, CO 80309
e-mail: j.aaron.porras@gmail.com
University of Colorado at Boulder,
Boulder, CO 80309
e-mail: j.aaron.porras@gmail.com
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Y. C. Lee,
Y. C. Lee
Professor
Department of Mechanical Engineering,
University of Colorado at Boulder,
Boulder, CO 80309
e-mail: leeyc@colorado.edu
Department of Mechanical Engineering,
University of Colorado at Boulder,
Boulder, CO 80309
e-mail: leeyc@colorado.edu
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Enisa Harris
Enisa Harris
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Akshay Sripada
Department of Mechanical Engineering,
University of Colorado at Boulder,
Boulder, CO 80309
e-mail: akshay.sripada@colorado.edu
University of Colorado at Boulder,
Boulder, CO 80309
e-mail: akshay.sripada@colorado.edu
Morgan Rohlfing
Department of Mechanical Engineering,
University of Colorado at Boulder,
Boulder, CO 80309
e-mail: morgan.rohlfing@gmail.com
University of Colorado at Boulder,
Boulder, CO 80309
e-mail: morgan.rohlfing@gmail.com
Raymond Vijaendreh
Department of Mechanical Engineering,
University of Colorado at Boulder,
Boulder, CO 80309
e-mail: vijaendrehraymond@gmail.com
University of Colorado at Boulder,
Boulder, CO 80309
e-mail: vijaendrehraymond@gmail.com
Brenden Spetzler
Department of Mechanical Engineering,
University of Colorado at Boulder,
Boulder, CO 80309
e-mail: spetzleb@colorado.edu
University of Colorado at Boulder,
Boulder, CO 80309
e-mail: spetzleb@colorado.edu
Ramsey Abdulhamid
Department of Mechanical Engineering,
University of Colorado at Boulder,
Boulder, CO 80309
e-mail: ramsey.abdulhamid@gmail.com
University of Colorado at Boulder,
Boulder, CO 80309
e-mail: ramsey.abdulhamid@gmail.com
Aaron Porras
Department of Mechanical Engineering,
University of Colorado at Boulder,
Boulder, CO 80309
e-mail: j.aaron.porras@gmail.com
University of Colorado at Boulder,
Boulder, CO 80309
e-mail: j.aaron.porras@gmail.com
Y. C. Lee
Professor
Department of Mechanical Engineering,
University of Colorado at Boulder,
Boulder, CO 80309
e-mail: leeyc@colorado.edu
Department of Mechanical Engineering,
University of Colorado at Boulder,
Boulder, CO 80309
e-mail: leeyc@colorado.edu
Ashish Gupta
Enisa Harris
1Corresponding author.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received September 16, 2015; final manuscript received April 6, 2016; published online May 16, 2016. Assoc. Editor: Yi-Shao Lai.
J. Electron. Packag. Sep 2016, 138(3): 031001 (8 pages)
Published Online: May 16, 2016
Article history
Received:
September 16, 2015
Revised:
April 6, 2016
Citation
Sripada, A., Rohlfing, M., Vijaendreh, R., Spetzler, B., Abdulhamid, R., Porras, A., Lee, Y. C., Gupta, A., and Harris, E. (May 16, 2016). "Use of a Gel Finger to Feel the Skin Temperatures of a Smartphone." ASME. J. Electron. Packag. September 2016; 138(3): 031001. https://doi.org/10.1115/1.4033376
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