Recent advances in flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill will be presented in this study. Emphasis is placed on the latest developments of these areas in the past few years. Their future trends will also be recommended.
Recent Advances and New Trends in Flip Chip Technology
ASM Pacific Technology,
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Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received April 6, 2016; final manuscript received June 22, 2016; published online July 25, 2016. Assoc. Editor: Eric Wong.
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Lau, J. H. (July 25, 2016). "Recent Advances and New Trends in Flip Chip Technology." ASME. J. Electron. Packag. September 2016; 138(3): 030802. https://doi.org/10.1115/1.4034037
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