Thermal performance for embedded two-phase cooling using dielectric coolant (R1234ze) is evaluated on a ∼20 mm × 20 mm large die. The test vehicles incorporate radial expanding channels with embedded pin fields suitable for through-silicon-via (TSV) interconnects of multidie stacks. Power generating features mimicking those anticipated in future generations of processor chips with eight cores are included. Initial results show that for the types of power maps anticipated, critical heat fluxes (CHFs) in “core” areas of at least 350 W/cm2 with at least 20 W/cm2 “background” heating in rest of the chip area can be achieved with less than 30 °C temperature rise over the inlet coolant temperature. These heat fluxes are significantly higher than those seen for relatively long parallel channel devices of similar base channel dimensions. Experimental results of flow rate, pressure drop, “device,” and coolant temperature are also provided for these test vehicles along with details of the test facility developed to properly characterize the test vehicles.

References

References
1.
Haron
,
N. Z.
, and
Hamdioui
,
S.
,
2008
, “
Why Is CMOS Scaling Coming to an END?
,”
3rd International Design and Test Workshop
(
IDT 2008
), Monastir, Tunisia, Dec. 20–22, pp.
98
103
.
2.
Kandlikar
,
S. G.
,
2014
, “
Review and Projections of Integrated Cooling Systems for Three-Dimensional Integrated Circuits
,”
ASME J. Electron. Packag.
,
136
(
2
), p.
024001
.
3.
Kandlikar
,
S. G.
,
2012
, “
History, Advances, and Challenges in Liquid Flow and Flow Boiling Heat Transfer in Microchannels: A Critical Review
,”
ASME J. Heat Transfer
,
134
(
3
), p.
034001
.
4.
Thome
,
J. R.
,
2004
, “
Boiling in Microchannels: A Review of Experiment and Theory
,”
Int. J. Heat Fluid Flow
,
25
(
2
), pp.
128
139
.
5.
Bhavnani
,
S.
,
Narayanan
,
V.
,
Qu
,
W. L.
,
Jensen
,
M.
,
Kandlikar
,
S.
,
Kim
,
J.
, and
Thome
,
J.
,
2014
, “
Boiling Augmentation With Micro/Nanostructured Surfaces: Current Status and Research Outlook
,”
Nanoscale Microscale Thermophys. Eng.
,
18
(
3
), pp.
197
222
.
6.
Chen
,
T. L.
, and
Garimella
,
S. V.
,
2012
, “
A Study of Critical Heat Flux During Flow Boiling in Microchannel Heat Sinks
,”
ASME J. Heat Transfer
,
134
(
1
), p.
011504
.
7.
Agostini
,
B.
,
Thome
,
J. R.
,
Fabbri
,
M.
, and
Michel
,
B.
,
2008
, “
High Heat Flux Two-Phase Cooling in Silicon Multimicrochannels
,”
IEEE Trans. Compon. Packag. Technol.
,
31
(
3
), pp.
691
701
.
8.
Poppe
,
A.
,
Horvath
,
G.
,
Bognar
,
G.
,
Kohari
,
Z.
,
Desmulliez
,
M. P. Y.
, and
Rencz
,
M.
,
2005
, “
Experimental Study of a Radial Micro-Channel Cooling Plate
,”
7th Electronics Packaging Technology Conference
(
EPTC
), Singapore, Dec. 7–9.
9.
Desmulliez
,
M. P. Y.
,
Pang
,
A. J.
,
Leonard
,
M.
,
Dhariwal
,
R. S.
,
Yu
,
W.
,
Abraham
,
E.
,
Bognar
,
G.
,
Poppe
,
A.
,
Horvath
,
G.
,
Kohari
,
Z.
,
Rencz
,
M.
,
Emerson
,
D. R.
,
Barber
,
R. W.
,
Slattery
,
O.
,
Waldron
,
F.
, and
Cordero
,
N.
,
2009
, “
Fabrication and Characterization of a Low-Cost, Wafer-Scale Radial Microchannel Cooling Plate
,”
IEEE Trans. Compon. Packag. Technol.
,
32
(
1
), pp.
20
29
.
10.
Muwanga
,
R.
,
Hassan
,
I.
, and
Ghorab
,
A.
,
2008
, “
Numerical Investigation of a Radial Microchannel Heat Exchanger With Varying Cross-Sectional Channels
,”
J. Thermophys. Heat Transfer
,
22
(
3
), pp.
321
332
.
11.
Ghaedamini
,
H.
,
Salimpour
,
M. R.
, and
Campo
,
A.
,
2011
, “
Constructal Design of Reverting Microchannels for Convective Cooling of a Circular Disc
,”
Int. J. Therm. Sci.
,
50
(
6
), pp.
1051
1061
.
12.
Daguenet-Frick
,
X.
,
Bonjour
,
J.
, and
Revellin
,
R.
,
2010
, “
Constructal Microchannel Network for Flow Boiling in a Disc-Shaped Body
,”
IEEE Trans. Compon. Packag. Technol.
,
33
(
1
), pp.
115
126
.
13.
Revellin
,
R.
,
Thome
,
J. R.
,
Bejan
,
A.
, and
Bonjour
,
J.
,
2009
, “
Constructal Tree-Shaped Microchannel Networks for Maximizing the Saturated Critical Heat Flux
,”
Int. J. Therm. Sci.
,
48
(
2
), pp.
342
352
.
14.
Ong
,
C. L.
,
Paredes
,
S.
,
Sridhar
,
A.
,
Michel
,
B.
, and
Brunschwiler
,
T.
,
2014
, “
μFLU14-6 Radial Hierarchical Microfluidic Evaporative Cooling for 3-D Integrated Microprocessors
,”
4th European Conference on Microfluidics
(
Microfluidics 2014
), Limerick, Ireland, Dec. 10–12.
You do not currently have access to this content.