This study investigates the reliability of low melt alloys (LMAs) containing gallium (Ga), indium (In), bismuth (Bi), and tin (Sn) for the application as Thermal interface materials (TIMs). The analysis described herein involved the in situ thermal performance of the LMAs as well as performance evaluation after accelerated life cycle testing, which included high temperature aging at 130 °C and thermal cycling from −40 °C to 80 °C. Three alloys (75.5Ga & 24.5In, 100Ga, and 51In, 32.5Bi & 16.5Sn) were chosen for testing the thermal performance. Testing methodologies used follow ASTM D5470 protocols and the performance of LMAs is compared with some high-performing commercially available TIMs. Results show that LMAs can offer extremely low (<0.01 cm2 °C/W) thermal resistance compared to any commercial TIMs. The LMA–substrate interactions were explored using different surface treatments (copper and tungsten). Measurements show that depending on the substrate–alloy combinations, the proposed alloys survive 1500 hrs of aging at 130 °C and 1000 cycles from −40 °C to 80 °C without significant performance degradation. The obtained results indicate the LMAs are very efficient as TIMs.
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March 2016
Research-Article
Durability of Low Melt Alloys as Thermal Interface Materials
Chandan K. Roy,
Chandan K. Roy
Mem. ASME
Department of Mechanical Engineering,
Auburn University,
2420 Wiggins Hall,
Auburn, AL 36849
e-mail: ckr0005@auburn.edu
Department of Mechanical Engineering,
Auburn University,
2420 Wiggins Hall,
Auburn, AL 36849
e-mail: ckr0005@auburn.edu
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Sushil Bhavnani,
Sushil Bhavnani
Department of Mechanical Engineering,
Auburn University,
1418C Wiggins Hall,
Auburn, AL 36849
e-mail: bhavnsh@auburn.edu
Auburn University,
1418C Wiggins Hall,
Auburn, AL 36849
e-mail: bhavnsh@auburn.edu
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Michael C. Hamilton,
Michael C. Hamilton
Department of Electrical and Computer Engineering,
Auburn University,
403 Broun Hall,
Auburn, AL 36849
e-mail: mch0021@auburn.edu
Auburn University,
403 Broun Hall,
Auburn, AL 36849
e-mail: mch0021@auburn.edu
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R. Wayne Johnson,
R. Wayne Johnson
Department of Electrical and Computer Engineering,
Tennessee Tech University,
217A Brown Hall,
Cookeville, TN 38505
e-mail: wjohnson@tntech.edu
Tennessee Tech University,
217A Brown Hall,
Cookeville, TN 38505
e-mail: wjohnson@tntech.edu
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Roy W. Knight,
Roy W. Knight
Department of Mechanical Engineering,
Auburn University,
3418B Wiggins Hall,
Auburn, AL 36849
e-mail: knighrw@auburn.edu
Auburn University,
3418B Wiggins Hall,
Auburn, AL 36849
e-mail: knighrw@auburn.edu
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Daniel K. Harris
Daniel K. Harris
Department of Mechanical Engineering,
Auburn University,
2418B Wiggins Hall,
Auburn, AL 36849
e-mail: harridk@auburn.edu
Auburn University,
2418B Wiggins Hall,
Auburn, AL 36849
e-mail: harridk@auburn.edu
Search for other works by this author on:
Chandan K. Roy
Mem. ASME
Department of Mechanical Engineering,
Auburn University,
2420 Wiggins Hall,
Auburn, AL 36849
e-mail: ckr0005@auburn.edu
Department of Mechanical Engineering,
Auburn University,
2420 Wiggins Hall,
Auburn, AL 36849
e-mail: ckr0005@auburn.edu
Sushil Bhavnani
Department of Mechanical Engineering,
Auburn University,
1418C Wiggins Hall,
Auburn, AL 36849
e-mail: bhavnsh@auburn.edu
Auburn University,
1418C Wiggins Hall,
Auburn, AL 36849
e-mail: bhavnsh@auburn.edu
Michael C. Hamilton
Department of Electrical and Computer Engineering,
Auburn University,
403 Broun Hall,
Auburn, AL 36849
e-mail: mch0021@auburn.edu
Auburn University,
403 Broun Hall,
Auburn, AL 36849
e-mail: mch0021@auburn.edu
R. Wayne Johnson
Department of Electrical and Computer Engineering,
Tennessee Tech University,
217A Brown Hall,
Cookeville, TN 38505
e-mail: wjohnson@tntech.edu
Tennessee Tech University,
217A Brown Hall,
Cookeville, TN 38505
e-mail: wjohnson@tntech.edu
Roy W. Knight
Department of Mechanical Engineering,
Auburn University,
3418B Wiggins Hall,
Auburn, AL 36849
e-mail: knighrw@auburn.edu
Auburn University,
3418B Wiggins Hall,
Auburn, AL 36849
e-mail: knighrw@auburn.edu
Daniel K. Harris
Department of Mechanical Engineering,
Auburn University,
2418B Wiggins Hall,
Auburn, AL 36849
e-mail: harridk@auburn.edu
Auburn University,
2418B Wiggins Hall,
Auburn, AL 36849
e-mail: harridk@auburn.edu
1Corresponding author.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received October 6, 2015; final manuscript received December 28, 2015; published online March 10, 2016. Assoc. Editor: Xiaobing Luo.
J. Electron. Packag. Mar 2016, 138(1): 010913 (7 pages)
Published Online: March 10, 2016
Article history
Received:
October 6, 2015
Revised:
December 28, 2015
Citation
Roy, C. K., Bhavnani, S., Hamilton, M. C., Wayne Johnson, R., Knight, R. W., and Harris, D. K. (March 10, 2016). "Durability of Low Melt Alloys as Thermal Interface Materials." ASME. J. Electron. Packag. March 2016; 138(1): 010913. https://doi.org/10.1115/1.4032462
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