InterPACK 2015, the flagship conference of the ASME Electronic and Photonic Packaging Division held on July 6–9, 2015 in San Francisco, CA, is the premier international forum for the exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronic packaging, MEMS, and NEMS. This is the first time that the InterPACK has been held jointly with the International Conference on Nanochannels, Microchannels, and Minichannels (ICNMM). Jointly organized and held, there was an outstanding technical program featuring more than 600 technical presentations in nine technical tracks. The Technical Track Committees comprise leading researchers and engineers from industrial companies, government laboratories, and academic institutions throughout the world. The nine tracks are: (1) Advanced Electronics and Photonics: Packaging, Interconnect, and Reliability, (2) Emerging Technology Frontiers, (3) MEMS and NEMS, (4) Thermal Management, (5) Thermal Management Using Microchannels, Jets, and Sprays, (6) Fundamentals of Thermal and Fluid...

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