This paper researches temporary bonding/debonding based on propylene carbonate (PPC). The highest shear strength of 4.1 MPa was achieved when pure PPC was used as bonding adhesive. Room temperature debonding methods were investigated and compared with thermal debonding. Chemical debonding at room temperature was realized for bonding with the pure PPC. Several different chemicals can be used for chemical debonding. A photo acid generator (PAG)-assisted debonding method was demonstrated at room temperature when PAG-loaded PPC (PAG-PPC) was used as bonding adhesive. The ultraviolet (UV) radiation was used to enhance the PAG-assisted debonding.

References

References
1.
Laplante
,
P. A.
,
2005
,
Comprehensive Dictionary of Electrical Engineering
,
CRC Press
,
Boca Raton
, pp.
603
629
.
2.
Fisher
,
G.
,
Seacrist
,
M. R.
, and
Standley
,
R. W.
,
2012
, “
Silicon Crystal Growth and Wafer Technologies
,”
Proc. IEEE
,
100
, pp.
1454
1474
.
3.
Lindroos
,
V.
,
Tilli
,
M.
,
Lehto
,
A.
, and
Motooka
,
T.
,
2010
,
Handbook of Silicon Based MEMS Materials and Technologies
,
William Andrew
,
Norwich, NY
, pp.
3
136
.
4.
Johnson
,
R. W.
, and
Shen
,
Y. L.
,
2015
, “
Analysis of Thermal Stress and Its Influence on Carrier Mobility in Three-Dimensional Microelectronic Chip Stack
,”
ASME J. Electron. Packag.
,
137
(
2
), p.
021011
.
5.
Sun
,
Y.
,
Thompson
,
S. E.
, and
Nishida
,
T.
,
2007
, “
Physics of Strain Effects in Semiconductors and Metal-Oxide-Semiconductor Field-Effect Transistors
,”
J. Appl. Phys.
,
101
(
10
), p.
104503
.
6.
Hoyt
,
J. L.
,
Nayfeh
,
H. M.
,
Eguchi
,
S.
,
Aberg
,
I.
,
Xia
,
G.
,
Drake
,
T.
,
Fitzgerald
,
E. A.
, and
Antoniadis
,
D. A.
,
2002
, “
Strained Silicon MOSFET Technology
,”
Tech. Dig.-Int. Electron Devices Meet.
,
2002
, pp.
23
26
.
7.
Chou
,
C. H.
,
Chan
,
W. S.
,
Lee
, I
. C.
,
Wang
,
C. L.
,
Wu
,
C. Y.
,
Yang
,
P. Y.
,
Liao
,
C. Y.
,
Wang
,
K. Y.
, and
Cheng
,
H. C.
,
2015
, “
High-Performance Single-Crystal-Like Strained-Silicon Nanowire Thin-Film Transistors Via Continuous-Wave Laser Crystallization
,”
IEEE Electron Device Lett.
,
36
(
4
), pp.
348
350
.
8.
Poborchii
,
V.
,
Hara
,
M.
,
Morita
,
Y.
, and
Tada
,
T.
,
2015
, “
Raman Spectroscopy of Ultrathin Strained-Silicon-on-Insulator: Size Effects in Strain, Elastic, and Phonon Properties
,”
Appl. Phys. Lett.
,
106
(
9
), p.
093107
.
9.
Azadeh
,
S. S.
,
Merget
,
F.
,
Nezhad
,
M. P.
, and
Witzens
,
J.
,
2015
, “
On the Measurement of the Pockels Effect in Strained Silicon
,”
Opt. Lett.
,
40
(
8
), pp.
1877
1880
.
10.
Chen
,
K. Y.
,
Zenner
,
R. L. D.
,
Ameson
,
M.
, and
Mountain
,
D.
,
2000
, “
Ultra-Thin Electronic Device Package
,”
IEEE Trans. Adv. Packag.
,
23
(
1
), pp.
22
26
.
11.
Priyabadini
,
S.
,
2013
, “
3D-Stacking of Ultra-Thin Chips and Chip Packages
,” Ph.D. thesis,
Ghent University
,
Ghent, Belgium
.
12.
Liu
,
D. P.
, and
Park
,
S.
,
2014
, “
Three-Dimensional and 2.5 Dimensional Interconnection Technology: State of the Art
,”
ASME J. Electron. Packag.
,
136
(
1
), p.
014001
.
13.
John
,
H. L.
,
2014
, “
Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration
,”
ASME J. Electron. Packag.
,
136
(
4
), p.
040801
.
14.
Yan
,
H.
,
Cannon
,
W. R.
, and
Shanefield
,
D.
,
1998
, “
Thermal Decomposition Behaviour of Poly(Propylene Carbonate)
,”
Ceram. Int.
,
24
(
6
), pp.
433
439
.
15.
Sain
,
M. M.
,
Ghosh
,
A.
, and
Banik
,
I.
,
2007
, “
Effect of Propylene Carbonate on the Properties of Composite Fiberboard From Wood Fiber Bonded With Renewable Wood Resin
,”
J. Reinf. Plast. Compos.
,
26
(
7
), pp.
705
713
.
16.
Fritz
,
N.
,
Dao
,
H.
,
Ann
,
S.
,
Allen
,
B.
, and
Kohl
,
P. A.
,
2012
, “
Polycarbonates as Temporary Adhesives
,”
Int. J. Adhes. Adhes.
,
38
, pp.
45
49
.
You do not currently have access to this content.