Recently, much attention has been given to reducing the thermal resistance attributed to thermal interface materials (TIMs) in electronic devices, which contribute significantly to the overall package thermal resistance. Thermal transport measured experimentally through several vertically aligned carbon nanotube (VACNT) array TIMs anchored to copper and silicon substrates is considered. A steady-state infrared (IR) microscopy experimental setup was designed and utilized to measure the cross-plane total thermal resistance of VACNT TIMs. Overall thermal resistance for the anchored arrays ranged from . These values are comparable to the best current TIMs used for microelectronic packaging. Furthermore, thermal stability after prolonged exposure to a high-temperature environment and thermal cycling tests shows limited deterioration for an array anchored using a silver-loaded thermal conductive adhesive (TCA).
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September 2015
Research-Article
Double-Sided Transferred Carbon Nanotube Arrays for Improved Thermal Interface Materials
Andrew J. McNamara,
Andrew J. McNamara
George W. Woodruff School of
Mechanical Engineering,
Mechanical Engineering,
Georgia Institute of Technology
,Atlanta, GA 30332
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Yogendra Joshi,
Yogendra Joshi
George W. Woodruff School of
Mechanical Engineering,
Mechanical Engineering,
Georgia Institute of Technology
,Atlanta, GA 30332
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Zhuomin Zhang,
Zhuomin Zhang
George W. Woodruff School of
Mechanical Engineering,
Mechanical Engineering,
Georgia Institute of Technology
,Atlanta, GA 30332
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Kyoung-sik Moon,
Kyoung-sik Moon
School of Materials Science and Engineering,
Georgia Institute of Technology
,Atlanta, GA 30332
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Ziyin Lin,
Ziyin Lin
School of Materials Science and Engineering,
Georgia Institute of Technology
,Atlanta, GA 30332
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Yagang Yao,
Yagang Yao
School of Materials Science and Engineering,
Georgia Institute of Technology
,Atlanta, GA 30332
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Ching-Ping Wong,
Ching-Ping Wong
School of Materials Science and Engineering,
Georgia Institute of Technology
,Atlanta, GA 30332
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Wei Lin
Albany Nanotechnology Center,
Wei Lin
IBM
,Albany Nanotechnology Center,
Albany, NY 12203
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Andrew J. McNamara
George W. Woodruff School of
Mechanical Engineering,
Mechanical Engineering,
Georgia Institute of Technology
,Atlanta, GA 30332
Yogendra Joshi
George W. Woodruff School of
Mechanical Engineering,
Mechanical Engineering,
Georgia Institute of Technology
,Atlanta, GA 30332
Zhuomin Zhang
George W. Woodruff School of
Mechanical Engineering,
Mechanical Engineering,
Georgia Institute of Technology
,Atlanta, GA 30332
Kyoung-sik Moon
School of Materials Science and Engineering,
Georgia Institute of Technology
,Atlanta, GA 30332
Ziyin Lin
School of Materials Science and Engineering,
Georgia Institute of Technology
,Atlanta, GA 30332
Yagang Yao
School of Materials Science and Engineering,
Georgia Institute of Technology
,Atlanta, GA 30332
Ching-Ping Wong
School of Materials Science and Engineering,
Georgia Institute of Technology
,Atlanta, GA 30332
Wei Lin
IBM
,Albany Nanotechnology Center,
Albany, NY 12203
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received December 4, 2014; final manuscript received April 22, 2015; published online July 14, 2015. Assoc. Editor: Gongnan Xie.
J. Electron. Packag. Sep 2015, 137(3): 031014 (6 pages)
Published Online: September 1, 2015
Article history
Received:
December 4, 2014
Revision Received:
April 22, 2015
Online:
July 14, 2015
Citation
McNamara, A. J., Joshi, Y., Zhang, Z., Moon, K., Lin, Z., Yao, Y., Wong, C., and Lin, W. (September 1, 2015). "Double-Sided Transferred Carbon Nanotube Arrays for Improved Thermal Interface Materials." ASME. J. Electron. Packag. September 2015; 137(3): 031014. https://doi.org/10.1115/1.4030802
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