Temperature rise could be a crucial issue for some electronic connectors subjected to the relative large electrical current. A nonstatistical multiscale sinusoidal rough surface (MSRS) model is adopted to estimate the contact area between matched metallic terminals as a function of contact load. A fast Fourier transform (FFT) is conducted to characterize the measured surface topology of the terminals. Multiphysics three-dimensional (3D) finite element analysis (FEA) is then carried out to evaluate the temperature rise of mated micro-universal serial bus (USB) connectors. Temperature distributions of the terminal based on the numerical simulations are in good agreement with those based on the measurements using a thermal couple and an infrared thermal camera as well.
Multiphysics Analysis for Temperature Rise of Electronic Connectors Using a Multiscale Model
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received March 26, 2015; final manuscript received June 2, 2015; published online June 24, 2015. Assoc. Editor: Satish Chaparala.
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Liao, K., and Lu, H. (September 1, 2015). "Multiphysics Analysis for Temperature Rise of Electronic Connectors Using a Multiscale Model." ASME. J. Electron. Packag. September 2015; 137(3): 031012. https://doi.org/10.1115/1.4030803
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