The extrapolation and generalization of accelerated test results for lead free solder joints require the identification of a damage function that can be counted on to apply beyond the region of the test. Individual ball grid array (BGA) scale Sn3Ag0.5Cu (SAC305) solder joints were subjected to isothermal shear fatigue testing at room temperature and 65 °C. The resulting mechanical response degradation and crack behavior, including strain hardening, crack initiation, and propagation, were correlated with the inelastic work and effective stiffness derived from load–displacement hysteresis loops. Crack initiation was found to scale with the accumulated work, independently of cycling amplitude and strain rate. The subsequent damage rate varied slightly with amplitude.
Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received September 4, 2014; final manuscript received December 8, 2014; published online January 21, 2015. Assoc. Editor: Eric Wong.
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Qasaimeh, A., Hamasha, S., Jaradat, Y., and Borgesen, P. (June 1, 2015). "Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue." ASME. J. Electron. Packag. June 2015; 137(2): 021012. https://doi.org/10.1115/1.4029441
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