A new design for an electro-osmotic flow (EOF) driven micropump was fabricated. Considering thermal management applications, three different types of micropumps were tested using multiple liquids. The micropumps were fabricated from a combination of materials, which included: silicon-polydimethylsiloxane (Si-PDMS), Glass-PDMS, or PDMS-PDMS. The flow rates of the micropumps were experimentally and numerically assessed. Different combinations of materials and liquids resulted in variable values of zeta-potential. The ranges of zeta-potential for Si-PDMS, Glass-PDMS, and PDMS-PDMS were −42.5–−50.7 mV, −76.0–−88.2 mV, and −76.0–−103.0 mV, respectively. The flow rates of the micropumps were proportional to their zeta-potential values. In particular, flow rate values were found to be linearly proportional to the applied voltages below 500 V. A maximum flow rate of 75.9 μL/min was achieved for the Glass-PDMS micropump at 1 kV. At higher voltages nonlinearity and reduction in flow rate occurred due to Joule heating and the axial electro-osmotic current leakage through the silicon substrate. The fabricated micropumps could deliver flow rates, which were orders of magnitude higher compared to the previously reported values for similar size micropumps. It is expected that such an increase in flow rate, particularly in the case of the Si-PDMS micropump, would lead to enhanced heat transfer for microchip cooling applications as well as for applications involving micrototal analysis systems (μTAS).
Skip Nav Destination
Nanoelectronic Materials Branch,
Materials and Manufacturing Directorate,
e-mail: ajit.roy@wpafb.af.mil
Nanoelectronic Materials Branch,
Materials and Manufacturing Directorate,
e-mail: sabyasachi.ganguli.2@us.af.mil
Article navigation
June 2015
Research-Article
Improved Flow Rate in Electro-Osmotic Micropumps for Combinations of Substrates and Different Liquids With and Without Nanoparticles
Marwan F. Al-Rjoub,
Marwan F. Al-Rjoub
Mem. ASME
School of Dynamic Systems,
e-mail: alrjoumf@mail.uc.edu
School of Dynamic Systems,
University of Cincinnati
,598 Rhodes Hall
,Cincinnati, OH 45221
e-mail: alrjoumf@mail.uc.edu
Search for other works by this author on:
Ajit K. Roy,
Nanoelectronic Materials Branch,
Materials and Manufacturing Directorate,
e-mail: ajit.roy@wpafb.af.mil
Ajit K. Roy
Air Force Research Laboratory
,Nanoelectronic Materials Branch,
Materials and Manufacturing Directorate,
2941 Hobson Way
,WPAFB, OH 45433-7750
e-mail: ajit.roy@wpafb.af.mil
Search for other works by this author on:
Sabyasachi Ganguli,
Nanoelectronic Materials Branch,
Materials and Manufacturing Directorate,
e-mail: sabyasachi.ganguli.2@us.af.mil
Sabyasachi Ganguli
Air Force Research Laboratory
,Nanoelectronic Materials Branch,
Materials and Manufacturing Directorate,
2941 Hobson Way
,WPAFB, OH 45433-7750
e-mail: sabyasachi.ganguli.2@us.af.mil
Search for other works by this author on:
Rupak K. Banerjee
Rupak K. Banerjee
1
Fellow ASME
School of Dynamic Systems,
e-mail: rupak.banerjee@uc.edu
School of Dynamic Systems,
University of Cincinnati
,593 Rhodes Hall
,Cincinnati, OH 45221
e-mail: rupak.banerjee@uc.edu
1Corresponding author.
Search for other works by this author on:
Marwan F. Al-Rjoub
Mem. ASME
School of Dynamic Systems,
e-mail: alrjoumf@mail.uc.edu
School of Dynamic Systems,
University of Cincinnati
,598 Rhodes Hall
,Cincinnati, OH 45221
e-mail: alrjoumf@mail.uc.edu
Ajit K. Roy
Air Force Research Laboratory
,Nanoelectronic Materials Branch,
Materials and Manufacturing Directorate,
2941 Hobson Way
,WPAFB, OH 45433-7750
e-mail: ajit.roy@wpafb.af.mil
Sabyasachi Ganguli
Air Force Research Laboratory
,Nanoelectronic Materials Branch,
Materials and Manufacturing Directorate,
2941 Hobson Way
,WPAFB, OH 45433-7750
e-mail: sabyasachi.ganguli.2@us.af.mil
Rupak K. Banerjee
Fellow ASME
School of Dynamic Systems,
e-mail: rupak.banerjee@uc.edu
School of Dynamic Systems,
University of Cincinnati
,593 Rhodes Hall
,Cincinnati, OH 45221
e-mail: rupak.banerjee@uc.edu
1Corresponding author.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received June 17, 2014; final manuscript received September 19, 2014; published online November 17, 2014. Assoc. Editor: Yi-Shao Lai.
This work is in part a work of the U.S. Government. ASME disclaims all interest in the U.S. Government's contributions.
J. Electron. Packag. Jun 2015, 137(2): 021001 (11 pages)
Published Online: June 1, 2015
Article history
Received:
June 17, 2014
Revision Received:
September 19, 2014
Online:
November 17, 2014
Citation
Al-Rjoub, M. F., Roy, A. K., Ganguli, S., and Banerjee, R. K. (June 1, 2015). "Improved Flow Rate in Electro-Osmotic Micropumps for Combinations of Substrates and Different Liquids With and Without Nanoparticles." ASME. J. Electron. Packag. June 2015; 137(2): 021001. https://doi.org/10.1115/1.4028746
Download citation file:
Get Email Alerts
Cited By
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
J. Electron. Packag (December 2024)
Related Articles
Thermal-Fluid MEMS Devices: A Decade of Progress and Challenges Ahead
J. Heat Transfer (November,2006)
Design and Characterization of a Magnetically Driven Valveless Micropump for Drug Delivery
J. Med. Devices (June,2009)
Electrokinetic-Driven Flow and Heat Transfer of a Non-Newtonian Fluid in a Circular Microchannel
J. Heat Transfer (February,2013)
An Experimental and Numerical Study of a Liquid Mixing Device for Microsystems
J. Electron. Packag (June,2005)
Related Proceedings Papers
Related Chapters
Key Technology of Interactive Music Game Installation based on Arduino
International Conference on Control Engineering and Mechanical Design (CEMD 2017)
Experiment Investigation of Flow Boiling Process Including Cavitation in Micro-Channel
Inaugural US-EU-China Thermophysics Conference-Renewable Energy 2009 (UECTC 2009 Proceedings)
Effects of Overburden Stresses on Soil Reclamation by Electroosmosis
Contaminated Sediments: Characterization, Evaluation, Mitigation/Restoration, and Management Strategy Performance