Through-hole anodic aluminum oxide (AAO) was fabricated by two steps anodization method. The pore diameter of the AAO was 40 nm. Cu nanowire array was prepared using the fabricated AAO as a template by electrochemical deposition. The mechanical and electrical performances of Cu nanowire surface fastener (NSF) were realized by the interconnection of Cu nanowire arrays. The shear and normal bonding strengths for the Cu NSF with 40 nm diameter nanowires were 3.38 × 10−3 and 2.46 × 10−3 N/cm2, respectively, and the parasitic resistance of it was approximately 22.5 Ω · cm2.
Fabrication of Anodic Aluminum Oxide Template and Copper Nanowire Surface Fastener
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received December 2, 2013; final manuscript received August 14, 2014; published online September 19, 2014. Assoc. Editor: Nils Høivik.
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Teshima, H., Kojima, K., and Ju, Y. (September 19, 2014). "Fabrication of Anodic Aluminum Oxide Template and Copper Nanowire Surface Fastener." ASME. J. Electron. Packag. December 2014; 136(4): 044501. https://doi.org/10.1115/1.4028316
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