Three-dimensional (3D) through-silicon-via (TSV) technology is emerging as a powerful technology to reduce package footprint, decrease interconnection power, higher frequencies, and provide efficient integration of heterogeneous devices. TSVs provide high speed signal propagation due to reduced interconnect lengths as compared to wire-bonding. The current flowing through the TSVs results in localized heat generation (joule heating), which could be detrimental to the device performance. The effect of joule heating on performance measured by transconductance, electron mobility (e− mobility), and channel thermal noise is presented. Results indicate that joule heating has a significant effect on the junction temperature and subsequently results in 10–15% performance hit.
Effect of Through-Silicon-Via Joule Heating on Device Performance for Low-Powered Mobile Applications
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received October 22, 2013; final manuscript received July 17, 2014; published online September 19, 2014. Assoc. Editor: Ashish Gupta.
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Mirza, F., Naware, G., Jain, A., and Agonafer, D. (September 19, 2014). "Effect of Through-Silicon-Via Joule Heating on Device Performance for Low-Powered Mobile Applications." ASME. J. Electron. Packag. December 2014; 136(4): 041008. https://doi.org/10.1115/1.4028076
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