In this paper, a thermal resistance network analytical model is proposed to investigate the thermal resistance and pressure drop in serpentine channel heat sinks with 180 deg bends. The total thermal resistance is obtained using a thermal resistance network model based on the equivalent thermal circuit method. Pressure drop is derived considering straight channel and bend loss because the bends interrupt the hydrodynamic boundary periodically. Considering the effects of laminar flow development and redevelopment, the bend loss coefficient is obtained as a function of the Reynolds number, aspect ratios, widths of fins, and turn clearances, through a three-regime correlation. The model is then experimentally validated by measuring the temperature and pressure characteristics of heat sinks with different Reynolds numbers and different geometric parameters. Finally, the temperature-rise and pressure distribution of the thermal fluid with Reynolds numbers of 500, 1000, and 1500 are examined utilizing this model.
Thermal Analysis and Experimental Validation of Laminar Heat Transfer and Pressure Drop in Serpentine Channel Heat Sinks for Electronic Cooling
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received October 20, 2013; final manuscript received April 6, 2014; published online May 12, 2014. Assoc. Editor: Masaru Ishizuka.
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Hao, X., Peng, B., Xie, G., and Chen, Y. (May 12, 2014). "Thermal Analysis and Experimental Validation of Laminar Heat Transfer and Pressure Drop in Serpentine Channel Heat Sinks for Electronic Cooling." ASME. J. Electron. Packag. September 2014; 136(3): 031009. https://doi.org/10.1115/1.4027508
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