Heat transfer enhancement using a rotationally oscillating plate in a channel containing heated blocks is numerically studied. The blocks simulate electronic chips with a high thermal dissipation rate. The model consists of a channel formed by two plates with heated blocks attached to bottom walls and a plate installed at the centerline of the channel. The rotationally oscillating plate enhances heat transfer from the blocks through the flow accelerating above the blocks. The effect of the frequency and maximum angle of attack of the plate on the Nusselt number is investigated for different Reynolds numbers. Heat transfer enhancement of the blocks with the plate is evaluated by comparing their thermal characteristics to a channel without plate. The results show that the oscillating plate enhances overall heat flow out of the blocks by 21.72% but with significant pressure drop of 300%.
Heat Transfer Enhancement for Blocks in a Channel Using a Rotationally Oscillating Plate
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received June 6, 2013; final manuscript received March 1, 2014; published online May 5, 2014. Assoc. Editor: Siddharth Bhopte.
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Alawadhi, E. M. (May 5, 2014). "Heat Transfer Enhancement for Blocks in a Channel Using a Rotationally Oscillating Plate." ASME. J. Electron. Packag. September 2014; 136(3): 031003. https://doi.org/10.1115/1.4027090
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