Greetings from Professor Bahgat G. Sammakia of Binghamton University (Editor from 2004 to 2014) and Professor Y. C. Lee of the University of Colorado Boulder (Editor from 2014 to 2019). We would like to express our appreciation to all the authors, reviewers, guest editors, and associate editors (AE) for their outstanding contributions. We would also like to thank our readers who have played an essential role in the stimulating process regarding the generation and dissemination of knowledge in the area of electronic packaging.

During the last ten years, it was a great pleasure working with the many outstanding AEs who served the JEP, the ASME staff, and with Mr. Gary Miller. Thanks to all of us working as a team, we were able to get the JEP to significantly reduce the time to publication. We were able to increase the impact factor, and we were...

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