This short communication addresses a numerical investigation of the thermal behavior of an electronic unit. The unit consists of several parallel planes and on the top and bottom planes heat is generated by a number of electronic chips. The heat is transported by conduction through plastic and copper-invar layers. Finally, the heat is rejected by a forced air stream in the center of the unit. The channel system for the cooling air is designed as an offset strip fin surface. A three-dimensional numerical method based on a thermal resistance or conductance network has been developed. The grid points on the cooling air side are staggered compared to the grid points in the solid materials. Details of the numerical method as well as some temperature distributions on the chip planes are provided.

References

References
1.
Asako
,
Y.
, and
Faghri
,
M.
,
1994
, “
Parametric Study of Turbulent Three-Dimensional Heat Transfer of Arrays of Heated Blocks Encountered in Electronic Equipment
,”
Int. J. Heat Mass Transfer
,
37
(3), pp.
469
478
.10.1016/0017-9310(94)90081-7
2.
Faghri
,
M.
, and
Asako
,
Y.
,
1994
, “
Prediction of Turbulent Three-Dimensional Heat Transfer of Heated Blocks Using Low-Reynolds Number Two-Equation Model
,”
Numer. Heat Transfer, Part A
,
26
(1), pp.
87
101
.10.1080/10407789408955982
3.
Ashiwake
,
N.
,
Nakayama
,
W.
,
Daikoku
,
T.
, and
Kobayashi
,
F.
,
1983
, “
Forced Convective Heat Transfer Form LSI Packages in An Air-Cooled Wiring Card Array
,” ASME Heat Transfer in Electronic Equipment, Boston, MA, November 13–18 (ASME Heat Transfer Symposia Series, HTD Vol. 28), pp.
35
42
.
4.
Nelson
,
R. D.
,
Sommerfeld
,
S.
, and
Bar-Cohen
,
A.
,
1992
, “
Thermal Performance of an Integral Immersion Cooled Multichip Module Package,” Microelectronics and Computer Technology Corporation
, Austin, TX, Technical Report No. HVE-253-92.
5.
Kim
,
Y. J.
,
Joshi
,
Y. K.
,
Fedorov
,
A. G.
,
Lee
,
Y. J.
, and
Lim
,
S. K.
,
2010
, “
Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional Integrated Circuits With Nonuniform Heat Flux
,”
ASME J. Heat Transfer
,
132
(4), p.
041009
.10.1115/1.4000885
6.
Mizunuma
,
H.
,
Lu
,
Y. C.
, and
Yang
,
C. L.
,
2011
, “
Thermal Modeling and Analysis for 3-D ICs With Integrated Microchannel Cooling
,”
IEEE Comput.-Aided Des. Integr. Circuits Syst.
,
30
(
9
), pp.
1293
1306
.10.1109/TCAD.2011.2144596
7.
Jain
,
A.
,
Jones
,
R. E.
,
Chatterjee
,
R.
, and
Pozder
,
S.
,
2010
, “
Analytical and Numerical Modeling of the Thermal Performance of Three-Dimensional Integrated Circuits
,”
IEEE Compon., Compon. Packag. Technol.
,
33
(
1
), pp.
56
63
.10.1109/TCAPT.2009.2020916
8.
Choobinech
,
L.
, and
Jain
,
A.
,
2012
, “
Analytical Solution for Steady-State and Transient Temperature Fields in Vertically Stacked 3-D Integrated Circuits
,”
IEEE Compon. Packag. Manuf. Technol.
,
2
(
12
), pp.
2031
2039
.10.1109/TCPMT.2012.2213820
9.
Choobinech
,
L.
, and
Jain
,
A.
,
2013
, “
Determination of Temperature Distribution in Three-Dimensional Integrated Circuits (3D ICs) With Unequally-Sized Die
,”
Appl. Therm. Eng.
,
56
(1–2), pp.
176
184
.10.1016/j.applthermaleng.2013.03.006
10.
Venkatadri
, V
.
,
Sammakia
,
B.
,
Srihari
,
K.
, and
Santos
,
D.
,
2011
, “
A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems
,”
ASME J. Electron. Packag.
,
133
(4), p.
040011
.10.1115/1.4005298
11.
Xie
,
X. L.
,
Tao
,
W. Q.
, and
He
,
Y. L.
,
2007
, “
Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink
,”
ASME J. Electron. Packag.
,
129
(3), pp.
247
255
.10.1115/1.2753887
12.
Xie
,
G. N.
,
Liu
,
J.
,
Zhang
,
W. H.
, and
Sunden
,
B.
,
2012
, “
Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling
,”
ASME J. Electron. Packag.
,
134
(4), p.
041010
.10.1115/1.4023035
13.
Arif
,
A. F. M.
,
Zubair
,
S. M.
, and
Pashah
,
S.
,
2012
, “
Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications
,”
ASME J. Electron. Packag.
,
134
(4), p.
041005
.10.1115/1.4007258
14.
Wieting
,
A. R.
,
1975
, “
Empirical Correlations for Heat Transfer and Flow Friction Characteristics of Rectangular Offset Fin Heat Exchangers
,”
ASME J. Heat Transfer
,
97
, pp.
488
490
.10.1115/1.3450412
15.
Manglik
,
R. M.
, and
Bergles
,
A. E.
,
1990
, “
The Thermal-Hydraulic Design of The Rectangular Offset Strip Fin Compact Heat Exchangers
,”
Compact Heat Exchangers
,
R. K.
Shah
,
A. D.
Kraus
, and
D.
Metzger
, eds.,
Hemisphere Publ. Corp.
,
Washington, DC
, pp.
123
149
.
You do not currently have access to this content.