This short communication addresses a numerical investigation of the thermal behavior of an electronic unit. The unit consists of several parallel planes and on the top and bottom planes heat is generated by a number of electronic chips. The heat is transported by conduction through plastic and copper-invar layers. Finally, the heat is rejected by a forced air stream in the center of the unit. The channel system for the cooling air is designed as an offset strip fin surface. A three-dimensional numerical method based on a thermal resistance or conductance network has been developed. The grid points on the cooling air side are staggered compared to the grid points in the solid materials. Details of the numerical method as well as some temperature distributions on the chip planes are provided.
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June 2014
Technical Briefs
Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink
Bengt Sundén,
Bengt Sundén
1
Division of Heat Transfer,
Department of Energy Sciences,
P.O. Box 118,
e-mail: bengt.sunden@energy.lth.se
Department of Energy Sciences,
Lund University
,P.O. Box 118,
Lund SE-22100
, Sweden
e-mail: bengt.sunden@energy.lth.se
1Corresponding author.
Search for other works by this author on:
Gongnan Xie
Gongnan Xie
Engineering Simulation and Aerospace
Computing (ESAC),
The Key Laboratory of Contemporary Design
and Integrated Manufacturing Technology,
P.O. Box 552,
e-mail: xgn@nwpu.edu.cn
Computing (ESAC),
The Key Laboratory of Contemporary Design
and Integrated Manufacturing Technology,
Northwestern Polytechnical University
,P.O. Box 552,
Xi'an, Shaanxi 710072
, China
e-mail: xgn@nwpu.edu.cn
Search for other works by this author on:
Bengt Sundén
Division of Heat Transfer,
Department of Energy Sciences,
P.O. Box 118,
e-mail: bengt.sunden@energy.lth.se
Department of Energy Sciences,
Lund University
,P.O. Box 118,
Lund SE-22100
, Sweden
e-mail: bengt.sunden@energy.lth.se
Gongnan Xie
Engineering Simulation and Aerospace
Computing (ESAC),
The Key Laboratory of Contemporary Design
and Integrated Manufacturing Technology,
P.O. Box 552,
e-mail: xgn@nwpu.edu.cn
Computing (ESAC),
The Key Laboratory of Contemporary Design
and Integrated Manufacturing Technology,
Northwestern Polytechnical University
,P.O. Box 552,
Xi'an, Shaanxi 710072
, China
e-mail: xgn@nwpu.edu.cn
1Corresponding author.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received June 29, 2013; final manuscript received January 12, 2014; published online April 29, 2014. Assoc. Editor: Gary Miller.
J. Electron. Packag. Jun 2014, 136(2): 024501 (5 pages)
Published Online: April 29, 2014
Article history
Received:
June 29, 2013
Revision Received:
January 12, 2014
Citation
Sundén, B., and Xie, G. (April 29, 2014). "Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink." ASME. J. Electron. Packag. June 2014; 136(2): 024501. https://doi.org/10.1115/1.4026538
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