Three-dimensional (3D) stacking of integrated-circuit (IC) dies increases system density and package functionality by vertically integrating two or more dies with area-array through-silicon-vias (TSVs). This reduces the length of global interconnects and the signal delay time and allows improvements in energy efficiency. However, the accumulation of heat fluxes and thermal interface resistances is a major limitation of vertically integrated packages. Scalable cooling solutions, such as two-phase interlayer cooling, will be required to extend 3D stacks beyond the most modest numbers of dies. This paper introduces a realistic 3D chip stack along with a simulation method for the heat spreading and flow distribution among the channels of the evaporators. The model includes the significant sensitivity of each channel's friction factor to vapor quality, and hence mass flow to heat flux, which characterizes parallel two-phase flows. Simulation cases explore various placements of hot spots within the stack and effects which are unique to two-phase interlayer cooling. The results show that the effect of hot spots on individual dies can be mitigated by strong interlayer heat conduction if the relative position of the hot spots is selected carefully to result in a heat load and flow which are well balanced laterally.
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June 2014
Research-Article
Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks
Yassir Madhour,
Yassir Madhour
Heat and Mass Transfer Laboratory,
Swiss Institute of Technology,
Swiss Institute of Technology,
EPFL STI IGM LTCM
,Lausanne CH-1015
, Switzerland
;
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Brian P. d'Entremont,
Brian P. d'Entremont
Heat and Mass Transfer Laboratory,
Swiss Institute of Technology,
e-mail: brian.dentremont@epfl.ch
Swiss Institute of Technology,
EPFL STI IGM LTCM
,Lausanne CH-1015
, Switzerland
e-mail: brian.dentremont@epfl.ch
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Jackson Braz Marcinichen,
Jackson Braz Marcinichen
Heat and Mass Transfer Laboratory,
Swiss Institute of Technology,
e-mail: jackson.marcinichen@epfl.ch
Swiss Institute of Technology,
EPFL STI IGM LTCM
,Lausanne CH-1015
, Switzerland
e-mail: jackson.marcinichen@epfl.ch
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John Richard Thome
John Richard Thome
Heat and Mass Transfer Laboratory,
Swiss Institute of Technology,
e-mail: john.thome@epfl.ch
Swiss Institute of Technology,
EPFL STI IGM LTCM
,Lausanne CH-1015
, Switzerland
e-mail: john.thome@epfl.ch
Search for other works by this author on:
Yassir Madhour
Heat and Mass Transfer Laboratory,
Swiss Institute of Technology,
Swiss Institute of Technology,
EPFL STI IGM LTCM
,Lausanne CH-1015
, Switzerland
;
Brian P. d'Entremont
Heat and Mass Transfer Laboratory,
Swiss Institute of Technology,
e-mail: brian.dentremont@epfl.ch
Swiss Institute of Technology,
EPFL STI IGM LTCM
,Lausanne CH-1015
, Switzerland
e-mail: brian.dentremont@epfl.ch
Jackson Braz Marcinichen
Heat and Mass Transfer Laboratory,
Swiss Institute of Technology,
e-mail: jackson.marcinichen@epfl.ch
Swiss Institute of Technology,
EPFL STI IGM LTCM
,Lausanne CH-1015
, Switzerland
e-mail: jackson.marcinichen@epfl.ch
Bruno Michel
John Richard Thome
Heat and Mass Transfer Laboratory,
Swiss Institute of Technology,
e-mail: john.thome@epfl.ch
Swiss Institute of Technology,
EPFL STI IGM LTCM
,Lausanne CH-1015
, Switzerland
e-mail: john.thome@epfl.ch
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received July 30, 2013; final manuscript received April 13, 2014; published online April 29, 2014. Assoc. Editor: Gongnan Xie.
J. Electron. Packag. Jun 2014, 136(2): 021006 (10 pages)
Published Online: April 29, 2014
Article history
Received:
July 30, 2013
Revision Received:
April 13, 2014
Citation
Madhour, Y., d'Entremont, B. P., Braz Marcinichen, J., Michel, B., and Richard Thome, J. (April 29, 2014). "Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks." ASME. J. Electron. Packag. June 2014; 136(2): 021006. https://doi.org/10.1115/1.4027436
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