A model of mini heat sink with microchannels was developed to obtain homogeneous heat transfer capability. The channels are constructed in the form of eight triangular arrays based on a square substrate. Air is sucked from the periphery to the center of the substrate by a vacuum pump and heat transferred from the bottom surface of substrate can be removed by air flowing through channels. Corresponding to the given heat transfer power and the target temperature of substrate, the relationship among length, width and depth of channel was analytically established. By numerical simulation, local pressure drops at the joint of channels and air duct are first obtained and then the dimensions of each channel in a triangular array can be determined one by one. The investigation reveals that the widths of channels will vary with their depths, lengths and pressure differences between two ends. Since all channels are required for the same cooling power, the homogeneous heat transfer of heat sink can be realized. By assembling a certain number of heat sink units, the area of dissipation of heat sink can be enlarged and contoured to fit close to heating surface.
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June 2014
Research-Article
Development of a Mini Heat Sink Model With Homogeneous Heat Transfer Capability
J. F. Zhou
J. F. Zhou
1
Jiangsu Key Laboratory of Process Enhancement
and New Energy Equipment Technology,
College of Mechanical and Power Engineering,
30 Puzhu Road,
e-mail: zhoujianfeng@njtech.edu.cn
and New Energy Equipment Technology,
College of Mechanical and Power Engineering,
Nanjing Tech University
,30 Puzhu Road,
Nanjing, Jiangsu 211816
, China
e-mail: zhoujianfeng@njtech.edu.cn
1Corresponding author.
Search for other works by this author on:
J. F. Zhou
Jiangsu Key Laboratory of Process Enhancement
and New Energy Equipment Technology,
College of Mechanical and Power Engineering,
30 Puzhu Road,
e-mail: zhoujianfeng@njtech.edu.cn
and New Energy Equipment Technology,
College of Mechanical and Power Engineering,
Nanjing Tech University
,30 Puzhu Road,
Nanjing, Jiangsu 211816
, China
e-mail: zhoujianfeng@njtech.edu.cn
1Corresponding author.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received July 24, 2013; final manuscript received March 26, 2014; published online April 29, 2014. Assoc. Editor: Gongnan Xie.
J. Electron. Packag. Jun 2014, 136(2): 021004 (8 pages)
Published Online: April 29, 2014
Article history
Received:
July 24, 2013
Revision Received:
March 26, 2014
Citation
Zhou, J. F. (April 29, 2014). "Development of a Mini Heat Sink Model With Homogeneous Heat Transfer Capability." ASME. J. Electron. Packag. June 2014; 136(2): 021004. https://doi.org/10.1115/1.4027338
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