The thermal characteristics of a laboratory pin-fin microchannel heat sink were empirically obtained for heat flux, q″, in the range of 30–170 W/cm2, mass flux, m, in the range of 230–380 kg/m2 s, and an exit vapor quality, xout, from 0.2 to 0.75. Refrigerant R 134a (HFC-134a) was chosen as the working fluid. The heat sink was a pin-fin microchannel module installed in open flow loop. Deviation from the measured average temperatures was 1.5 °C at q = 30 W/cm2, and 2.0 °C at q = 170 W/cm2. These results indicate that use of pin-fin microchannel heat sink enables keeping an electronic device near uniform temperature under steady state and transient conditions. The heat transfer coefficient varied significantly with refrigerant quality and showed a peak at an exit vapor quality of 0.55 in all the experiments. At relatively low heat fluxes and vapor qualities, the heat transfer coefficient increased with vapor quality. At high heat fluxes and vapor qualities, the heat transfer coefficient decreased with vapor quality. A noteworthy feature of the present data is the larger magnitude of the transient heat transfer coefficients compared to values obtained under steady state conditions. The results of transient boiling were compared with those for steady state conditions. In contrast to the more common techniques, the low cost technique, based on open flow loop was developed to promote cooling using micropin fin sinks. Results of this experimental study may be used for designing the cooling high power laser and rocket-born electronic devices.
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June 2014
Research-Article
Thermal Management of Time-Varying High Heat Flux Electronic Devices
T. David,
T. David
Department of Mechanical Engineering,
Technion—Israel Institute of Technology
,Haifa 32000
, Israel
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D. Mendler,
D. Mendler
Department of Mechanical Engineering,
Technion—Israel Institute of Technology
,Haifa 32000
, Israel
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A. Mosyak,
A. Mosyak
Department of Mechanical Engineering,
Technion—Israel Institute of Technology
,Haifa 32000
, Israel
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A. Bar-Cohen,
A. Bar-Cohen
Mechanical Engineering Department,
University of Maryland
,College Park, MD 20742
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G. Hetsroni
G. Hetsroni
1
Department of Mechanical Engineering,
e-mail: hetsroni@techunix.technion.ac.il
Technion—Israel Institute of Technology
,Haifa 32000
, Israel
e-mail: hetsroni@techunix.technion.ac.il
1Corresponding author.
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T. David
Department of Mechanical Engineering,
Technion—Israel Institute of Technology
,Haifa 32000
, Israel
D. Mendler
Department of Mechanical Engineering,
Technion—Israel Institute of Technology
,Haifa 32000
, Israel
A. Mosyak
Department of Mechanical Engineering,
Technion—Israel Institute of Technology
,Haifa 32000
, Israel
A. Bar-Cohen
Mechanical Engineering Department,
University of Maryland
,College Park, MD 20742
G. Hetsroni
Department of Mechanical Engineering,
e-mail: hetsroni@techunix.technion.ac.il
Technion—Israel Institute of Technology
,Haifa 32000
, Israel
e-mail: hetsroni@techunix.technion.ac.il
1Corresponding author.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received July 4, 2013; final manuscript received March 27, 2014; published online April 29, 2014. Assoc. Editor: Gongnan Xie.
J. Electron. Packag. Jun 2014, 136(2): 021003 (10 pages)
Published Online: April 29, 2014
Article history
Received:
July 4, 2013
Revision Received:
March 27, 2014
Citation
David, T., Mendler, D., Mosyak, A., Bar-Cohen, A., and Hetsroni, G. (April 29, 2014). "Thermal Management of Time-Varying High Heat Flux Electronic Devices." ASME. J. Electron. Packag. June 2014; 136(2): 021003. https://doi.org/10.1115/1.4027325
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