This study goes beyond the common microchannel cooling system composed of uniform parallel straight microchannels and proposed a three-stage design approach for spatially thermal-aware microchannel cooling of 2D multicore processors. By applying effective strategies and arranging key design parameters, stronger cooling is provided under the high power core area, and less cooling is provided under the low power cache area to effectively save the precious pumping power, lower the hot spot temperature and lower temperature gradients on chip. Two microchannel cooling systems are specifically designed for a 2 core 150 W Intel Tulsa processor and an 8 core 260 W (doubled power) Intel Nehalem processor with single phase HFE7100 as coolant. For the Tulsa processor, a strategy named strip-and-zone is used. The final design leads to 30 kPa pressure drop and 0.094 W pumping power while maintains the hot spot temperature to be . For the Nehalem processor, a split flow microchannel system and a widen-inflow strategy are applied. A design is achieved to cost 15 kPa pressure drop and 0.0845 W pumping power while maintains the hot spot temperature to be . The design approach in this study provides the basic guide for the industrial applications of effective multicore processor cooling using microchannels.
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June 2014
Research-Article
Thermal-Aware Microchannel Cooling of Multicore Processors: A Three-Stage Design Approach
Yubai Li,
5000 Forbes Avenue,
Yubai Li
Carnegie Mellon University
,5000 Forbes Avenue,
Pittsburgh, PA 15213
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Dongzhi Guo,
5000 Forbes Avenue,
Dongzhi Guo
Carnegie Mellon University
,5000 Forbes Avenue,
Pittsburgh, PA 15213
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Shi-Chune Yao
5000 Forbes Avenue,
Shi-Chune Yao
Carnegie Mellon University
,5000 Forbes Avenue,
Pittsburgh, PA 15213
Search for other works by this author on:
Yubai Li
Carnegie Mellon University
,5000 Forbes Avenue,
Pittsburgh, PA 15213
Dongzhi Guo
Carnegie Mellon University
,5000 Forbes Avenue,
Pittsburgh, PA 15213
Shi-Chune Yao
Carnegie Mellon University
,5000 Forbes Avenue,
Pittsburgh, PA 15213
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received June 25, 2013; final manuscript received February 17, 2014; published online April 29, 2014. Assoc. Editor: Gongnan Xie.
J. Electron. Packag. Jun 2014, 136(2): 021002 (10 pages)
Published Online: April 29, 2014
Article history
Received:
June 25, 2013
Revision Received:
February 17, 2014
Citation
Li, Y., Guo, D., and Yao, S. (April 29, 2014). "Thermal-Aware Microchannel Cooling of Multicore Processors: A Three-Stage Design Approach." ASME. J. Electron. Packag. June 2014; 136(2): 021002. https://doi.org/10.1115/1.4027174
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