This paper presents an approach for reducing detailed numerical models of electronic equipment into compact thermal-fluid models. These compact models have been created using network analogies representing mass, momentum and energy transport to reduce computational demand, preserve manufacturer intellectual property, and enable software independent exchange of information between supplier and integrator. A strategic approach is demonstrated for a steady state case from reduction to model integration within a global environment. The compact model is robust to boundary condition variation by developing a boundary condition response matrix for the network layout. A practical example of electronic equipment cooled naturally in air is presented. Solution times were reduced from ∼100 to ∼10−3 CPU hours when using the compact model. Nodal information was predicted with O(10%) accuracy compared to detailed solutions. For parametric design studies, the reduced model can provide 1800 solutions in the same time required to run a single detailed numerical simulation. The information generated by the reduction process also enhances collaborative design by providing the equipment integrator with ordered initial conditions for the equipment in the optimization of the global design. Sensitivity of the compact model to spatial variations on the boundary node faces has also been assessed. Overall, the compact modeling approach developed extends the use of compact models beyond preliminary design and into detailed phases of the product design lifecycle.

References

References
1.
Lasance
,
C. J. M.
,
2008
, “
Ten Years of Boundary-Condition-Independent Compact Thermal Modeling of Electronic Parts: A Review
,”
Heat Trans. Eng.
,
29
(2),
149
168
.10.1080/01457630701673188
2.
Stafford
,
J.
,
Grimes
,
R.
, and
Newport
,
D.
,
2012
, “
Development of Compact Thermal-Fluid Models at the Electronic Equipment Level
,”
ASME J. Therm. Sci. Eng. Appl.
,
4
(3), p. 031007.10.1115/1.4006715
3.
Joshi
,
Y.
,
2012
, “
Reduced Order Thermal Models of Multiscale Microsystems
,”
ASME J. Heat Transfer
,
134
(3), p.
031008
.10.1115/1.4005150
4.
Nie
,
Q.
, and
Joshi
,
Y.
,
2008
, “
Multiscale Thermal Modeling Methodology for Thermoelectrically Cooled Electronic Cabinets
,”
Numer. Heat Transfer, Part A
,
53
(
3
), pp.
225
248
.10.1080/10407780701564101
5.
Samadiana
,
E.
, and
Joshi
,
Y.
,
2010
, “
Proper Orthogonal Decomposition for Reduced Order Thermal Modeling of Air Cooled Data Centers
,”
ASME J. Heat Transfer
,
132
(7), p.
071402
.10.1115/1.4000978
6.
Song
,
Z.
,
Murray
,
B. T.
, and
Sammakia
,
B.
,
2013
, “
Airflow and Temperature Distribution Optimization in Data Centers Using Artificial Neural Networks
,”
Int. J., Heat Mass Transfer
,
64
, pp.
80
90
.10.1016/j.ijheatmasstransfer.2013.04.017
7.
Song
,
Z.
,
Murray
,
B. T.
, and
Sammakia
,
B.
,
2014
, “
A Dynamic Compact Model Thermal Model for Data Center Analysis and Control Using the Zonal Method and Artificial Neural Networks
,”
Appl. Therm. Eng.
,
62
(
1
), pp.
48
57
.10.1016/j.applthermaleng.2013.09.006
8.
ansys Icepak, V13.5, Ansys, Inc, Canonsburg, PA.
9.
Mentor Graphics FloTHERM, Mentor Graphics, Wilsonville, OR.
10.
Rosten
,
H. I.
,
Lasance
,
C. J. M.
, and
Parry
,
J. D.
,
1997
, “
The World of Thermal Characterization According to DELPHI—Part I: Background to DELPHI
,”
IEEE Trans. Compon. Packag. Manuf. Technol. Part A
,
20
(
4
), pp.
384
391
.10.1109/95.650927
11.
Lasance
,
C. J. M.
,
Rosten
,
H. I.
, and
Parry
,
J. D.
,
1997
, “
The World of Thermal Characterization According to DELPHI—Part II: Experimental and Numerical Methods
,”
IEEE Trans. Compon. Packag. Manuf. Technol., Part A
,
20
(
4
), pp.
392
398
.10.1109/95.650928
12.
Lasance
,
C. J. M.
,
Vinke
,
H.
, and
Rosten
,
H.
,
1995
, “
Thermal Characterization of Electronic Devices With Boundary Condition Independent Compact Models
,”
IEEE Trans. Compon. Packag. Manuf. Technol., Part A
,
18
(
4
), pp.
723
731
.10.1109/95.477457
13.
JEDEC, 2013, “DELPHI Compact Thermal Model Guideline,” JEDEC, Arlington, VA, JEDEC Standard JESD15-4.
14.
Raghupathy
,
A. P.
,
Janssen
,
J.
,
Aranyosi
,
A.
,
Ghia
,
U.
,
Ghia
,
K.
, and
Maltz
,
W.
,
2011
, “
Development of DELPHI-Type Compact Thermal Models for Opto-Electronic Packages
,”
ASME J. Electron. Packag.
,
133
(1), p.
011003
.10.1115/1.4003217
15.
Hu
,
X.
,
Lin
,
S.
, and
Stanton
,
S.
,
2010
, “
A Novel Thermal Model for HEV/EV Battery Modelling Based on CFD Calculation
,” IEEE Energy Conversion Congress and Exposition (
ECCE
), Atlanta, GA, September 12–16, pp. 893–90010.1109/ECCE.2010.5617897.
16.
Coleman
,
P.
,
2011
, “
Developing the Behavioural Digital Aircraft
,” 6th European Aeronautics Days, Madrid, Spain, March 30–April 1.
17.
Dunk
,
A. S.
,
2004
, “
Product Life Cycle Cost Analysis: The Impact of Customer Profiling, Competitive Advantage, and Quality of IS Information
,”
Manage. Account. Res.
,
15
, pp.
401
414
.10.1016/j.mar.2004.04.001
18.
Montgomery
,
D. C.
,
2001
,
Design and Analysis of Experiments
,
5th ed.
,
Wiley & Sons, Inc.
, New York.
19.
Cullimore
,
B.
,
Ring
,
S.
, and
Baumann
,
J.
,
2004
, “
Customizable Multidiscipline Environments for Heat Transfer and Fluid Flow Modeling
,”
SAE
Technical Paper No. 2004-01-2275.10.4271/2004-01-2275
You do not currently have access to this content.