Looping is one of the key technologies for modern thermosonic wire bonders, and it has been affected by many interacting factors. In this study, the wire looping process was observed with a high-speed camera, and the evolution of wire profiles during looping and the capillary trace were obtained through experiments. A dynamic finite element (FE) model was developed to learn the details of the looping process, where real capillary geometry dimensions, capillary trace, diameter of bonded ball and the gold wire material were used, and the friction force and air tension force were considered. The simulated profiles were compared with those of the experiment. Using the verified FE model, the effects of material properties, capillary parameters, and capillary traces on the looping process were studied, and the relationships between the final profiles and parameters were discussed.
Skip Nav Destination
Article navigation
December 2013
Research-Article
Experimental and Modeling Studies of Looping Process for Wire Bonding
Yun Chen
Yun Chen
State Key Laboratory of High
Performance Complex Manufacturing,
School of Mechanical and Electrical Engineering,
Changsha 410083,
Performance Complex Manufacturing,
School of Mechanical and Electrical Engineering,
Central South University
,Changsha 410083,
China
Search for other works by this author on:
Fuliang Wang
e-mail: wangfuliang@csu.edu.cn
Yun Chen
State Key Laboratory of High
Performance Complex Manufacturing,
School of Mechanical and Electrical Engineering,
Changsha 410083,
Performance Complex Manufacturing,
School of Mechanical and Electrical Engineering,
Central South University
,Changsha 410083,
China
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received July 16, 2013; final manuscript received September 17, 2013; published online November 18, 2013. Assoc. Editor: Yi-Shao Lai.
J. Electron. Packag. Dec 2013, 135(4): 041009 (9 pages)
Published Online: November 18, 2013
Article history
Received:
July 16, 2013
Revision Received:
September 17, 2013
Citation
Wang, F., and Chen, Y. (November 18, 2013). "Experimental and Modeling Studies of Looping Process for Wire Bonding." ASME. J. Electron. Packag. December 2013; 135(4): 041009. https://doi.org/10.1115/1.4025667
Download citation file:
Get Email Alerts
Cited By
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
J. Electron. Packag (December 2024)
Related Articles
Formation of Plastic Creases in Thin Polyimide Films
J. Appl. Mech (May,2020)
Combining Freehand Ultrasound-Based Indentation and Inverse Finite Element Modeling for the Identification of Hyperelastic Material Properties of Thigh Soft Tissues
J Biomech Eng (September,2020)
Passive Stress–Strain Measurements in the Stage-16 and Stage-18 Embryonic Chick Heart
J Biomech Eng (November,1997)
Parametric Design and Reliability Analysis of Wire Interconnect Technology Wafer Level Packaging
J. Electron. Packag (September,2002)
Related Chapters
Load Transfer in Single Rivet-Row Lap Joints (Conventional and Countersunk)
Structural Shear Joints: Analyses, Properties and Design for Repeat Loading
Compilation of Results for Open Hole Panels and Butt Joints
Structural Shear Joints: Analyses, Properties and Design for Repeat Loading
Compilation of Results for Lap Joints
Structural Shear Joints: Analyses, Properties and Design for Repeat Loading