Kinks have a strong influence on the structural performance of wire bonds. In this study, a variable-length link-spring model has been developed to better understand kink formation. In this model, a gold wire was decomposed into segments that were represented by a link and a torsional spring. One end of the gold wire was fixed, and the other end was free. The friction and air tension forces at the wire ends were considered a function of the capillary position, and the wire segments and moment balance equations were added at the free end as the wire length increased. By using this model, the wire profile, moment, and curvature diagrams at the reverse motion stage were obtained to study the dynamical kink formation and wire-length increasing processes. The analysis result was verified experimentally. Good agreement is obtained between the analytical and the experimental wire profiles. This study indicates that a moment magnitude of several hundred mN·μm is required to form a kink, and the wire profile is the result of the residual curvature and the instantaneous bending moment.
Skip Nav Destination
Complex Manufacturing,
Article navigation
December 2013
Research-Article
Variable-Length Link-Spring Model for Kink Formation During Wire Bonding
Lei Han
Complex Manufacturing,
Lei Han
State Key Laboratory of High Performance
Complex Manufacturing,
Changsha 410083
, China;
School of Mechanical and Electrical Engineering,
Central South University,
Central South University,
Changsha 410083
, China
Search for other works by this author on:
Fuliang Wang
e-mail: wangfuliang@csu.edu.cn
Lei Han
State Key Laboratory of High Performance
Complex Manufacturing,
Changsha 410083
, China;
School of Mechanical and Electrical Engineering,
Central South University,
Central South University,
Changsha 410083
, China
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received June 5, 2012; final manuscript received July 13, 2013; published online September 19, 2013. Assoc. Editor: Kaustubh Nagarkar.
J. Electron. Packag. Dec 2013, 135(4): 041004 (6 pages)
Published Online: September 19, 2013
Article history
Received:
June 5, 2012
Revision Received:
July 13, 2013
Citation
Wang, F., Tang, W., Li, J., and Han, L. (September 19, 2013). "Variable-Length Link-Spring Model for Kink Formation During Wire Bonding." ASME. J. Electron. Packag. December 2013; 135(4): 041004. https://doi.org/10.1115/1.4025308
Download citation file:
Get Email Alerts
Cited By
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
J. Electron. Packag (December 2024)
Related Articles
On-Line Quality Detection of Ultrasonic Wire Bonding via Refining Analysis of Electrical Signal From Ultrasonic Generator
J. Electron. Packag (December,2010)
Numerical Study of Wire Bonding—Analysis of Interfacial Deformation Between Wire and Pad
J. Electron. Packag (March,2002)
Failure Estimation of Semiconductor Chip During Wire Bonding Process
J. Electron. Packag (June,1999)
Multiple Quality Characteristics Optimization of Ball Grid Array Wire Bonding Process
J. Electron. Packag (December,2015)
Related Proceedings Papers
Related Chapters
Room-Temperature Stress Relaxation of High-Strength Strip and Wire Spring Steels—Procedures and Data
Stress Relaxation Testing
Experimental Research of Dynamic Parameters of Stranded-Wire Helical Springs under Impact Load
International Conference on Mechanical Engineering and Technology (ICMET-London 2011)
Development of Impacting Fatigue Test Device of Stranded Wires Helical Springs
International Conference on Information Technology and Management Engineering (ITME 2011)