The thermal and the optoelectronic performance of high power gallium arsenide (GaAs) laser diode die-attached with sintered silver joint were investigated. The thermal and mechanical characteristics of the Laser bar packaging were simulated by finite element analysis (FEA). On the basis of prior experimental observations, voids in the bonding layer were intentionally introduced in the FEA model to examine their effect on the laser diode operating in the continuous-wave (CW) mode under different drive currents. The simulation results indicate that the quality of the bonding layer is very important to the heat dissipation capability of the packaging. Any void in the die-attach material would become a hotspot and thus deteriorate the optoelectronic performance of the laser diode. In addition, because of the coefficient of thermal expansion (CTE) mismatch between the laser bar and the copper heat sink, the interfacial thermomechanical stress will cause a noticeable curvature of the laser diode and a blueshift in the wavelength.
Skip Nav Destination
Article navigation
December 2013
Research-Article
Effects of Voids in Sintered Silver Joint on Thermal and Optoelectronic Performances of High Power Laser Diode
Yi Yan,
Yi Yan
Department of Materials
Science and Engineering,
Science and Engineering,
Virginia Tech
,Blacksburg, VA 24061
Search for other works by this author on:
Youliang Guan,
Youliang Guan
Department of Engineering
Science and Mechanics,
Science and Mechanics,
Virginia Tech
,Blacksburg, VA 24061
Search for other works by this author on:
Xu Chen,
Xu Chen
1
School of Chemical
Engineering and Technology,
e-mail: xchen@tju.edu.cn
Engineering and Technology,
Tianjin University
,Tianjin 300072
, China
e-mail: xchen@tju.edu.cn
1Corresponding author.
Search for other works by this author on:
Guo-Quan Lu
Guo-Quan Lu
Department of Materials
Science and Engineering,
Science and Engineering,
Virginia Tech
,Blacksburg, VA 24061
Tianjin Key Laboratory of
Advanced Joining Technology,
School of Materials Science and Engineering,
Advanced Joining Technology,
School of Materials Science and Engineering,
Tianjin University
,Tianjin 300072
, China
Search for other works by this author on:
Yi Yan
Department of Materials
Science and Engineering,
Science and Engineering,
Virginia Tech
,Blacksburg, VA 24061
Youliang Guan
Department of Engineering
Science and Mechanics,
Science and Mechanics,
Virginia Tech
,Blacksburg, VA 24061
Xu Chen
School of Chemical
Engineering and Technology,
e-mail: xchen@tju.edu.cn
Engineering and Technology,
Tianjin University
,Tianjin 300072
, China
e-mail: xchen@tju.edu.cn
Guo-Quan Lu
Department of Materials
Science and Engineering,
Science and Engineering,
Virginia Tech
,Blacksburg, VA 24061
Tianjin Key Laboratory of
Advanced Joining Technology,
School of Materials Science and Engineering,
Advanced Joining Technology,
School of Materials Science and Engineering,
Tianjin University
,Tianjin 300072
, China
1Corresponding author.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received April 19, 2013; final manuscript received July 11, 2013; published online September 4, 2013. Assoc. Editor: Shidong Li.
J. Electron. Packag. Dec 2013, 135(4): 041003 (6 pages)
Published Online: September 4, 2013
Article history
Received:
April 19, 2013
Revision Received:
July 11, 2013
Citation
Yan, Y., Guan, Y., Chen, X., and Lu, G. (September 4, 2013). "Effects of Voids in Sintered Silver Joint on Thermal and Optoelectronic Performances of High Power Laser Diode." ASME. J. Electron. Packag. December 2013; 135(4): 041003. https://doi.org/10.1115/1.4025247
Download citation file:
Get Email Alerts
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
J. Electron. Packag (December 2024)
Related Articles
Thermal Stresses Due to Laser Welding in Bridge-Wire Initiators
J. Electron. Packag (March,2009)
Design and Fabrication of Leadless Package Structure for Pressure Sensors
J. Electron. Packag (December,2022)
Thermoelastic Stresses in an Axisymmetric Thick-Walled Tube Under an Arbitrary Internal Transient
J. Pressure Vessel Technol (August,2004)
Temperature Distribution and Thermal Stress Analysis of Ball-Tank Subjected to Solar Radiation
J. Pressure Vessel Technol (May,2005)
Related Proceedings Papers
Related Chapters
Subsection NB—Class 1 Components
Companion Guide to the ASME Boiler & Pressure Vessel Codes, Volume 1 Sixth Edition
Analysis of Components in VIII-2
Guidebook for the Design of ASME Section VIII Pressure Vessels, Third Edition
Design Criteria for Thermal Stress
Process Piping: The Complete Guide to ASME B31.3, Third Edition