Failures in IT electronics are often caused by falling or external shocks during transportation. These failures cause customers to mistrust the reliability of the products. Many manufacturers of IT electronics have not only used cushioning materials but also increased the shock resistance of their products for failure prevention. Especially in case of printer products, the design of the packaging and the product robustness are extremely important because of their substantial weight and the fragility of the internal modules. For product design, it is essential to understand the impact failure mechanism of the products. In this study, a compression test, a drop impact test, and a finite element analysis (FEA) were performed to analyze the dynamic behaviors of a packaged multifunction printer (MFP). The mechanical properties of a cushioning material were measured by compression tests. The FE models of the cushion packaging and the MFP included the physical characteristics of the internal modules, and their dynamic behaviors were obtained using the commercial software ls-dyna3d. Simulation results were also compared with drop test results to verify the proposed FE models. The shock resistance of the MFP was assessed by stress analysis and strength evaluation. We also expect our FE models will be useful for evaluating the fragility of the internal modules because the models can numerically estimate the shock acceleration profiles of the internal modules, which are difficult to measure experimentally.

References

References
1.
Printer Market Report
,
2007
, Electronics Information Center
2.
Ong
,
Y. C.
,
Shim
,
V. P. W.
,
Chai
,
T. C.
, and
Lim
,
C. T.
,
2003
, “
Comparison of Mechanical Response of PCBs Subjected to Product-Level and Board-Level Drop Impact Tests
,”
Electronics Packaging Technology Conference
(
EPTC 2003
), Singapore, December 10–12, pp.
223
227
.10.1109/EPTC.2003.1271520
3.
Tee
,
T. Y.
,
Luan
,
J.
,
Pek
,
E.
,
Lim
,
C. T.
, and
Zhong
,
Z.
,
2004
, “
Advanced Experimental and Simulation Techniques for Analysis of Dynamic Responses During Drop Impact
,”
54th Electronic Components and Technology Conference
(
ECTC 2004
), Las Vegas, NV, June 1–4, pp.
1088
1094
.10.1109/ECTC.2004.1319475
4.
Lim
,
C. T.
,
Teo
,
Y. M.
, and
Shim
,
V. P. W.
,
2002
, “
Numerical Simulation of the Drop Impact Response of a Portable Electronic Product
,”
IEEE Trans. Compon. Packag. Technol.
,
25
(
3
), pp.
478
485
.10.1109/TCAPT.2002.803652
5.
Takada
,
S.
, and
Musha
,
A.
,
2003
, “
Mobile-Phone Structural Design Technology
,”
Mitsubishi Electric Adv.
,
102
, pp.
18
20
.
6.
Joung
,
J. H.
,
Kim
,
H. B. R.
,
Seong
,
Y. H.
, and
Choi
,
H. H.
,
2007
, “
A Study on Strength Evaluation of LCD Glass for Drop Test
,”
J. Korean Soc. Precis. Eng.
,
24
(
10
), pp.
99
108
.
7.
Shim
,
V. P. W.
,
Yuan
,
J.
, and
Lee
,
S. H.
,
2001
, “
A Technique for Rapid Two-Stage Dynamic Tensile Loading of Polymers
,”
Exp. Mech.
,
41
(
1
), pp.
122
127
.10.1007/BF02323114
8.
Chung
,
W. J.
,
Booh
,
S. W.
, and
Kim
,
K. T.
,
1995
, “
Drop/Impact Analysis of Electronic Products With Packaging Materials
,”
Proceedings of KSME Autumn Conference
, Daejeon, South Korea, November, pp.
228
234
.
9.
Kim
,
W. J.
,
Kim
,
H. B. L.
, and
Park
,
S. H.
,
2000
, “
A Study on the Cushion Package Design of a Monitor Using Finite Element Method
,”
J. Korean Soc. Precis. Eng.
,
17
(
12
), pp.
88
93
.
10.
Kim
,
Y. J.
, and
Koo
,
J. C.
,
2003
, “
Study on Impact Analysis and Shock Resistance Improvement of Large LCD TV
,” Samsung Electronics, Suwon, South Korea.
11.
Choi
,
S. S.
, and
Lee
,
J. G.
,
2003
, “
Development of LCD-Oriented Impact Analysis System
,”
Proceedings of KSME Autumn Conference
, Muju, South Korea, November 5–7, pp.
1419
1424
.
12.
LS-DYNA Theory Manual
,
2006
, Livermore Software Technology. Corp., Livermore, CA.
13.
LS-DYNA Keyword User's Manual
,
2007
, version 971, Livermore Software Technology. Corp., Livermore, CA.
14.
ASTM D1596-97
,
2003
, “Standard Test Method for Dynamic Shock Cushioning Characteristics of Packaging Material,” British Standards Institution, London.
15.
Lim
,
C. T.
,
Teo
,
Y. M.
, and
Shim
,
V. P. W.
,
2002
, “
Numerical Simulation of the Drop Impact Response of a Portable Electronic Product
,”
IEEE Trans. Compon. Packag. Technol
,
25
(
3
), pp.
478
48
5.10.1109/TCAPT.2002.803652
16.
Harris
,
C. M.
, and
Piersol
,
A. G.
,
2002
,
Harris' Shock and Vibration Handbook
,
5th ed.
,
McGraw-Hill
,
New York
, pp.
20
.13
17.
ASTM D3332-99
,
2004
, “Standard Test Methods for Mechanical-Shock Fragility of Products, Using Shock Machines,” British Standards Institution, London.
You do not currently have access to this content.