Heat conduction analysis is performed on a model system to survey the effects of geometric and thermal parameters on the temperature of an embedded heat source. A box model has the geometric characteristics of hand-held devices and has a laminar organization composed of a printed circuit board (PCB), air gap, and a system casing. Exploiting the laminar organization and thinness of the laminate an approximate solution is derived. The solution is used to produce a guide for thermal design analysts, which is concerned with the sensitivity of the heat source temperature to the effective thermal conductivity of the PCB. Numerical examples are shown for the models that have typical dimensions and material properties of actual equipment and PCB.
Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer Model
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received December 23, 2011; final manuscript received April 24, 2013; published online June 4, 2013. Assoc. Editor: Gamal Refai-Ahmed.
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Nakayama, W. (June 4, 2013). "Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer Model." ASME. J. Electron. Packag. September 2013; 135(3): 034501. https://doi.org/10.1115/1.4024367
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