It is well known that the flow distribution in data centers can be effected by a variety of parameters such as rack and computer room air conditioning (CRAC) positions, raised-floor height, ceiling height, and percentage opening of perforated tiles. In the present paper, numerical simulations are conducted to optimize the layout of a raised-floor data center with respect to these parameters. Two different approaches have been used: parametric optimization; and a multivariable approach using response surface optimization. In the parametric optimization procedure, the data center is optimized with respect to the maximum temperature in the room. While in the multivariable approach, a cost function is constructed from all the rack inlet temperatures and is minimized. The results show that the multivariable approach is computationally economical and the optimized layout gives a better thermal performance compared to that of parametric optimization.
A Comparison of Parametric and Multivariable Optimization Techniques in a Raised-Floor Data Center
Mechanical and Mechatronic Engineering,
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received December 28, 2011; final manuscript received November 12, 2012; published online July 24, 2013. Assoc. Editor: Saurabh Shrivastava.
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Nagarathinam, S., Fakhim, B., Behnia, M., and Armfield, S. (July 24, 2013). "A Comparison of Parametric and Multivariable Optimization Techniques in a Raised-Floor Data Center." ASME. J. Electron. Packag. September 2013; 135(3): 030905. https://doi.org/10.1115/1.4023214
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