Design, fabrication, and test results of a novel 3-layer RF package using a commonly available high frequency laminate are presented in this paper. The developed package can be manufactured using standard multilayer printed circuit board (PCB) manufacturing techniques making it cost effective for commercial applications. The package exhibits excellent RF characteristics up to 6 GHz.
A Novel Low Cost Package for Radio Frequency Applications
Centre for Applied Research in Electronics,
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received December 15, 2011; final manuscript November 3, 2012; published online March 28, 2013. Assoc. Editor: Stephen McKeown.
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Chaturvedi, S., and Koul, S. K. (March 28, 2013). "A Novel Low Cost Package for Radio Frequency Applications." ASME. J. Electron. Packag. June 2013; 135(2): 024501. https://doi.org/10.1115/1.4023041
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