Wearout reliability and high temperature storage life (HTSL) activation energy of Au and Pd-coated Cu (PdCu) ball bonds are useful technical information for Cu wire deployment in nanoscale semiconductor device packaging. This paper discusses the influence of wire type on the wearout reliability performance of Au and PdCu wire used in fine pitch BGA package after HTSL stress at various aging temperatures. Failure analysis has been conducted to identify the failure mechanism after HTSL wearout conditions for Au and PdCu ball bonds. Apparent activation energies (Eaa) of both wire types are investigated after HTSL test at 150 °C, 175 °C and 200 °C aging temperatures. Arrhenius plot has been plotted for each ball bond types and the calculated Eaa of PdCu ball bond is 0.85 eV and 1.10 eV for Au ball bond in 110 nm semiconductor device. Obviously Au ball bond is identified with faster IMC formation rate with IMC Kirkendall voiding while PdCu wire exhibits equivalent wearout and or better wearout reliability margin compare to conventional Au wirebond. Lognormal plots have been established and its mean to failure (t50) have been discussed in this paper.

References

References
1.
Gan
,
C. L.
,
Toong
,
T. T.
,
Lim
,
C. P.
, and
Ng
,
C. Y.
,
2010
, “
Environmental Friendly Package Development by Using Copper Wire
,” 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (
IEMT
), Malacca, Malaysia, November 30–December 2.10.1109/IEMT.2010.5746747
2.
Gan
,
C. L.
,
Ng
,
E. K.
,
Chan
,
B. L.
, and
Hashim
,
U.
,
2012
, “
Reliability Challenges of Cu Wire Deployment in Flash Memory Packaging
,” 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (
IMPACT
), Taipei, Taiwan, October 24–26, pp. 236–239.10.1109/IMPACT.2012.6420214
3.
Gan
,
C. L.
,
Ng
,
E. K.
,
Chan
,
B. L.
,
Hashim
,
U.
, and
Classe
,
F. C.
,
2012
, “
Technical Barriers and Development of Cu Wirebonding in Nanoelectronic Device Packaging
,”
J. Nanomater.
,
173025
, pp.
1
7
.10.1155/2012/173025
4.
Gan
,
C. L.
,
Ng
,
E. K.
,
Chan
,
B. L.
,
Kwuanjai
,
T.
, and
Hashim
,
U.
,
2012
, “
Wearout Reliability Study of Cu and Au Wires Used in Flash Memory Fine Line BGA Package
,” 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (
IMPACT
), Taipei, Taiwan, October 24–26, pp. 232–235.10.1109/IMPACT.2012.6420213
5.
Tan
,
C. W.
,
Daud
,
A. R.
, and
Yarmo
,
A. M.
,
2002
, “
Corrosion Study at Cu-Al Interface in Microelectronics Packaging
,”
J. Appl. Surf. Sci.
,
191
, pp.
67
73
.10.1016/S0169-4332(02)00150-2
6.
Tan
,
C. W.
, and
Daud
,
A. R.
,
2002
, “
The Effects of Aged Cu-Al Intermetallics to Electrical Resistance in Microelectronics Packaging
,”
Microelectron. Int.
,
19
(
2
), pp.
38
43
.10.1108/13565360210427889
7.
Yu
,
C.-F.
,
Chan
,
C.-M.
,
Chan
,
L.-C.
, and
Hsieh
,
K.-C.
,
2011
, “
Cu Wire Bond Microstructure Analysis and Failure Mechanism
,”
Microelectron. Reliab.
,
51
, pp.
119
124
.10.1016/j.microrel.2010.04.022
8.
Lin
,
Y.-W.
,
Ke
,
W.-B.
,
Wang
,
R.-Y.
,
Wang
,
I.-S.
,
Chiu
,
Y.-T.
,
Lu
,
K.-C.
,
Lin
,
K.-L.
, and
Lai
,
Y.-S.
,
2012
, “
The Influence of Pd on the Interfacial Reactions Between the Pd-Plated Cu Ball Bond and Al Pad
,”
Surf. Coat. Technol.
(in press).10.1016/j.surfcoat.2012.07.033
9.
Harman
,
G. G.
,
1989
,
Wirebonding in Microelectronics: Processes, Reliability, and Yield
,
2nd ed.
,
McGraw-Hill
,
New York
, pp.
50
126
.
10.
Hang
,
C. J.
,
Wang
,
C. Q.
,
Mayer
,
M.
,
Tian
,
Y. H.
,
Zhou
,
Y.
, and
Wang
,
H. H.
,
2008
, “
Growth Behavior of Cu/Al Intermetallic Compounds and Cracks in Copper Ball Bonds During Isothermal Aging
,”
Micron. Reliab.
,
48
, pp.
416
424
.10.1016/j.microrel.2007.06.008
11.
JEDEC Specification
,
2010
, “
Failure Mechanisms and Models for Semiconductor Devices
,” Paper No. JEP 122 2010.
12.
Classe
,
F. C.
, and
Gaddamraja
,
S.
,
2011
, “
Long Term Isothermal Reliability of Copper Wire Bonded to Thin 6.5 μm Aluminum
,” IEEE International Reliability Physics Symposium (
IRPS
), Monterey, CA, April 10–14.10.1109/IRPS.2011.5784557
13.
JEDEC Standard
,
2012
, “
Stress Test Driven Qualification of Integrated Circuits
, Paper No. 2012 JESD 47.
14.
McPherson
,
J. W.
,
2010
,
Reliability Physics and Engineering: Time to Failure Modelling
,
1st ed.
,
Springer
,
New York
, pp.
258
261
.
15.
Li
,
J.
,
Wang
,
F.
,
Han
,
L.
, and
Zhong
,
J.
,
2008
, “
Theoretical and Experimental Analysis of Atom Diffusion Characteristics on Wirebonding Interface
,”
J. Phys. D: Appl. Phys.
,
41
(13), p. 135303.10.1088/0022-3727/41/13/135303
16.
Xu
,
H.
,
Liu
,
C.
,
Silberschmidt
, and
Chen
,
Z.
,
2010
, “
Growth of Intermetallic Compounds in Thermosonic Copper Wire Bonding on Aluminium Metallization
,”
J. Electron. Mater.
,
39
(1), pp.
124
131
.10.1007/s11664-009-0951-8
17.
Xu
,
H.
,
Liu
,
C.
,
Silberschmidt
,
V. V.
,
Pramana
,
S. S.
,
White
,
T. J.
, and
Chen
,
Z.
,
2009
, “
A Re-Examination of the Mechanism of Thermosonic Copper Ball Bonding on Aluminium Metallization Pad
,”
Scr. Mater.
,
61
(2), pp.
165
–168.10.1016/j.scriptamat.2009.03.034
18.
Xu
,
H.
,
Liu
,
C.
,
Silberschmidt
,
V. V.
,
Pramana
,
S. S.
,
White
,
T. J.
,
Chen
,
Z.
, and
Acoff
,
V. L.
,
2011
, “
Behavior of Aluminum Oxide, Intermetallics and Voids in Cu–Al Wire Bonds
,”
Acta Mater.
,
59
(14), pp.
5661
5673
.10.1016/j.actamat.2011.05.041
19.
Jeng
,
Y. R.
,
Aoh
,
J. H.
, and
Wang
,
C. M.
,
2001
, “
Thermosonic Wirebonding of Gold Wire Onto Copper Pad Using the Saturated Interface Phenomena
,”
J. Phys. D: Appl. Phys.
,
34
(24), pp.
3515
3521
.10.1088/0022-3727/34/24/316
20.
Kim
,
H. J.
,
Lee
,
J. Y.
, and
Paik
,
K. W.
,
2003
, “
Effects of Cu/Al Intermetallic Compound (IMC) on Copper Wire and Aluminium Pad Bondability
,”
IEEE Trans. Compon. Packag. Technol.
,
26
(
2
), pp.
367
374
.10.1109/TCAPT.2003.815121
21.
Zulrich
,
C. M.
,
Hashibon
,
A.
,
Svoboda
,
J.
,
Elsasser
,
C.
,
Helm
,
D.
, and
Riedel
,
H.
,
2011
, “
Diffusion Kinetics in Aluminium-Gold Bond Contacts From First Principles Density Functional Calculations
,”
Acta Mater.
,
59
, pp.
7634
7644
.10.1016/j.actamat.2011.08.021
22.
Kim
,
S. H.
,
Park
,
J. W.
,
Hong
,
S. J.
, and
Moon
,
J. T.
,
2010
, “
The Interface Behavior of the Cu-Al Bond System in High Humidity Conditions
,” 12th Electronics Packaging Technology Conference (
EPTC
), Singapore, December 8–10, pp. 545–549.10.1109/EPTC.2010.5702699
23.
Breach
,
C.
, and
Wulff
,
F.
,
2004
, “
New Observations on Intermetallic Compound Formation in Gold Ball Bonds: General Growth Pattern and Identification of Two Forms of Au4Al
,”
Microelectron. Reliab.
,
44
(
6
), pp.
973
981
.10.1016/j.microrel.2004.02.013
24.
Murali
,
S.
,
Srikanth
,
N.
, and
Charles
,
J. V.
, III
,
2006
, “
An Evaluation of Gold and Copper Wirebonds on Shear and Pull Testing
,”
J. Electron. Packag.
,
128
, pp.
192
201
.10.1115/1.2229214
25.
Breach
,
C.
, and
Wulff
,
F.
,
2006
, “
Oxidation of Au4Al in Unmolded Gold Ballbonds After High Temperature Storage (HTS) in Air at 175°C
,”
Microelectron. Reliab.
,
46
, pp.
2112
2121
.10.1016/j.microrel.2005.12.009
26.
JEDEC Specification
,
2010
, “
High Temperature Storage Life
,” Paper No. JESD22A-103D 2010.
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