This research focused on extending the applications of fused deposition modeling (FDM) by extrusion and deposition of low melting temperature metal alloys to create three-dimensional metal structures and single-layer contacts which may prove useful for electronic interconnects. Six commercially available low melting temperature solder alloys (Bi36Pb32Sn31Ag1, Bi58Sn42, Sn63Pb37, Sn50Pb50, Sn60Bi40, Sn96.5Ag3.5) were tested for the creation of a fused deposition modeling for metals (FDMm) system with special attention given to Sn–Bi solders. An existing FDM 3000 was used and two alloys were successfully extruded through the system's extrusion head. Deposition was achieved through specific modifications to system toolpath commands and a comparison of solders with eutectic and non-eutectic compositions is discussed. The modifications demonstrate the ability to extrude simple single-layer solder lines with varying thicknesses, including sharp 90 deg angles and smooth curved lines and showing the possibility of using this system for printed circuit board applications in which various connections need to be processed. Deposition parameters altered for extrusion and the deposition results of low melting temperature metal alloys are introduced.
Development of a Fused Deposition Modeling System for Low Melting Temperature Metal Alloys
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the Journal of Electronic Packaging. Manuscript received February 28, 2012; final manuscript received June 22, 2012; published online February 26, 2013. Assoc. Editor: Kyoung-sik (Jack) Moon.
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Mireles, J., Kim, H., Hwan Lee, I., Espalin, D., Medina, F., MacDonald, E., and Wicker, R. (February 26, 2013). "Development of a Fused Deposition Modeling System for Low Melting Temperature Metal Alloys." ASME. J. Electron. Packag. March 2013; 135(1): 011008. https://doi.org/10.1115/1.4007160
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