Computer simulation is a practical approach for the accurate study of nanosized materials. In order to produce conductive nano-inks for microelectrodes, we need to simulate different nanoparticles (NPs)’ arrangements to maximize their packing. Even though modeling can be performed on desktop computers using binary packing, this is a time consuming process that may not provide optimal results for practical applications. In this study, we developed a simulation program for a supercomputer to obtain precise results from tertiary packing while reducing the simulation time. The simulation of nanoparticles' packing consists of three different sized particles resulting in a high packing factor of 93.44%. Therefore, the optimal sizes and volumes of particles required for nano-inks with various viscosities can be predetermined. Furthermore, a wide range of applications can be derived such as finding ideal ratios of particles or inks for different mixtures.
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March 2013
Research-Article
Computational Monolayer for Tertiary Nanoparticles Using Supercomputer
Kyungdeok Jang,
Kyungdeok Jang
Department of Metallurgical and Materials Engineering,
El Paso, TX 79968
e-mail: playzanggu@gmail.com
The University of Texas at El Paso
,El Paso, TX 79968
e-mail: playzanggu@gmail.com
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Nubia Zuverza,
Nubia Zuverza
Department of Metallurgical and Materials Engineering,
El Paso, TX 79968
e-mail: nzuverza@miners.utep.edu
The University of Texas at El Paso
,El Paso, TX 79968
e-mail: nzuverza@miners.utep.edu
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Tae Eui Jeong,
Tae Eui Jeong
Department of Nano Convergence Engineering,
Seoul, 136-704,
e-mail: tejeong@skuniv.ac.kr
Seokyeong University
,Seoul, 136-704,
Korea
e-mail: tejeong@skuniv.ac.kr
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Sung Suk Kim,
Sung Suk Kim
Department of Computer Science,
Seoul 136-704,
e-mail: sskim03@skuniv.ac.kr
Seokyeong University
,Seoul 136-704,
Korea
e-mail: sskim03@skuniv.ac.kr
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Nam Soo Kim
Nam Soo Kim
1
Department of Metallurgical and Materials Engineering,
El Paso, TX 79968
e-mail: nkim@utep.edu
The University of Texas at El Paso
,El Paso, TX 79968
e-mail: nkim@utep.edu
1Corresponding author.
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Kyungdeok Jang
Department of Metallurgical and Materials Engineering,
El Paso, TX 79968
e-mail: playzanggu@gmail.com
The University of Texas at El Paso
,El Paso, TX 79968
e-mail: playzanggu@gmail.com
Nubia Zuverza
Department of Metallurgical and Materials Engineering,
El Paso, TX 79968
e-mail: nzuverza@miners.utep.edu
The University of Texas at El Paso
,El Paso, TX 79968
e-mail: nzuverza@miners.utep.edu
Tae Eui Jeong
Department of Nano Convergence Engineering,
Seoul, 136-704,
e-mail: tejeong@skuniv.ac.kr
Seokyeong University
,Seoul, 136-704,
Korea
e-mail: tejeong@skuniv.ac.kr
Sung Suk Kim
Department of Computer Science,
Seoul 136-704,
e-mail: sskim03@skuniv.ac.kr
Seokyeong University
,Seoul 136-704,
Korea
e-mail: sskim03@skuniv.ac.kr
Nam Soo Kim
Department of Metallurgical and Materials Engineering,
El Paso, TX 79968
e-mail: nkim@utep.edu
The University of Texas at El Paso
,El Paso, TX 79968
e-mail: nkim@utep.edu
1Corresponding author.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received January 5, 2012; final manuscript received December 29, 2012; published online March 26, 2013. Assoc. Editor: Kyoung-sik Moon.
J. Electron. Packag. Mar 2013, 135(1): 011003 (6 pages)
Published Online: March 26, 2013
Article history
Received:
January 5, 2012
Revision Received:
December 29, 2012
Citation
Jang, K., Zuverza, N., Eui Jeong, T., Suk Kim, S., and Soo Kim, N. (March 26, 2013). "Computational Monolayer for Tertiary Nanoparticles Using Supercomputer." ASME. J. Electron. Packag. March 2013; 135(1): 011003. https://doi.org/10.1115/1.4023527
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