The pull force and displacement of gold (Au) and copper (Cu) wires in microelectronics are investigated in this study. Emphasis is placed on (1) the development of a set of equations for determining the internal forces and deformations of wires when subjected to an external pull force, (2) the determination of the maximum pull force (when the wire breaks) based on some failure criteria of the wires, and (3) the experimental verification of the present equations.

References

References
1.
Lau
,
J. H.
,
2011
,
Reliability of RoHS Compliant 2D & 3D IC Interconnects
,
McGraw-Hill
,
New York
.
2.
Lau
,
J. H.
,
Lee
,
C. K.
,
Premachandran
,
C. S.
, and
Yu
,
A.
,
2010
,
Advanced MEMS Packaging
,
McGraw-Hill
,
New York.
3.
Moore
,
G.
,
1965
, “
Cramming More Components Onto Integrated Circuits
,”
Electronics
,
38
(
8
), pp.
114
117
.
4.
Harman
,
G.
,
2010
,
Wire Bonding in Microelectronics
,
McGraw-Hill
,
New York.
5.
Prasad
,
S.
,
2004
,
Advanced Wirebond Interconnection Technology
,
Springer
,
New York
.
6.
Lau
,
J. H.
,
1995
,
Flip Chip Technologies
,
McGraw-Hill
,
New York
.
7.
Lau
,
J. H.
,
2000
,
Low-Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
,
McGraw-Hill
,
New York
.
8.
Lau
,
J. H.
,
1992
,
Handbook of Tape Automated Bonding, Van Nostrand Reinhold
,
New York
.
9.
Onuki
,
J.
,
Koizumi
,
M.
, and
Araki
,
I.
,
1987
, “
Investigation of the Reliability of Copper Ball Bonds to Aluminum Electrodes
,”
IEEE Trans. Compon., Hybrids, Manuf. Technol.,
12
(
4
), pp.
550
555
.10.1109/TCHMT.1987.1134799
10.
Toyozawa
,
K.
,
Fujita
,
K.
,
Minamide
,
S.
, and
Maeda
,
T.
,
1990
, “
Development of Copper Wire Bonding Application Technology
,”
IEEE Trans. Compon., Hybrids, Manuf. Technol.
,
13
(
4
), pp.
667
672
.10.1109/33.62577
11.
Khoury
,
S.
,
Burkhard
,
D.
,
Galloway
,
D.
, and
Scharr
,
T.
,
1990
, “
A Comparison of Copper and Gold Wire Bonding on Integrated Circuit Devices
,”
IEEE Trans. Compon., Hybrids, Manuf. Technol.
,
13
(
4
), pp.
673
681
.10.1109/33.62578
12.
Caers
,
J.
,
Bischoff
,
A.
,
Falk
,
J.
, and
Roggen
,
J.
,
1993
, “
Conditions for Reliable Ball-Wedge Copper Wire Bonding
,”
Proceedings of 1993 Japan International Electronic Manufacturing Technology Symposium
,
Kanazawa, Japan
, June 9–11, pp.
312
315
.10.1109/IEMT.1993.639786
13.
Nguyen
,
L.
,
McDonald
,
D.
,
Danker
,
A.
, and
Ng
,
P.
,
1995
, “
Optimization of Copper Wire Bonding on Al-Cu Metallization
,”
IEEE Trans. Compon., Hybrids, Manuf. Technol. Part A
,
18
(
2
), pp.
423
429
.10.1109/95.390327
14.
Tan
,
J.
,
Toh
,
B.
, and
Ho
,
H.
,
2004
, “
Modelling of Free Air Ball for Copper Wire Bonding
,”
Proceedings of the 6th IEEE Electronics Packaging and Technology Conference
,
Singapore
, December 8–10, pp.
711
717
.10.1109/EPTC.2004.1396700
15.
Xu
,
H.
,
Liu
,
C.
,
Silberschmidt
,
V.
, and
Wang
,
H.
,
2008
, “
Effects of Process Parameters on Bondability in Thermosonic Copper Ball Bonding
,”
Proceedings of 58th IEEE Electronic Components & Technology Conference
,
Lake Buena Vista, FL
, May 27–30, pp.
1424
1430
.10.1109/ECTC.2008.4550164
16.
Uno
,
T.
,
Terashima
,
S.
, and
Yamada
,
T.
,
2009
, “
Surface-Enhanced Copper Bonding Wire for LSI
,”
Proceedings of 59th IEEE Electronic Components & Technology Conference
,
San Diego, CA
, May 26–29, pp.
1486
1495
.10.1109/ECTC.2009.5074209
17.
Deley
,
M.
, and
Levine
,
L.
,
2005
, “
Copper Ball Bonding Advances for Leading Edge Packaging
,”
Proceedings of Semicon Singapore 2005
,
Singapore
, May 4–6.
18.
Kim
,
H.
,
Lee
,
J.
,
Paik
,
K.
,
Koh
,
K.
,
Won
,
J.
,
Choe
,
S.
,
Lee
,
J.
,
Moon
,
J.
, and
Park
,
Y.
,
2003
, “
Effects of Cu/Al Intermetallic Compound (IMC) on Copper Wire and Aluminum Pad Bondability
,”
IEEE Trans. Compon. Packag. Technol.
,
26
(
2
), pp.
367
374
.10.1109/TCAPT.2003.815121
19.
Wulff
,
F.
,
Breach
,
C.
,
Stephan
,
D.
,
Saraswati
,
A.
, and
Dittmer
,
K.
,
2004
, “
Characterisations of Intermetallic Growth in Copper and Gold Ball Bonds on Aluminum Metallization
,”
Proceedings of 6th IEEE Electronics Packaging and Technology Conference
,
Singapore
, Dec. 8–10, pp.
348
353
.10.1109/EPTC.2004.1396632
20.
Zhang
,
S.
,
Chen
,
C.
,
Lee
,
R.
,
Lau
,
A.
,
Tsang
,
P.
,
Mohamed
,
L.
,
Chan
,
C.
, and
Dirkzwager
,
M.
,
2006
, “
Characterization of Intermetallic Compound Formation and Copper Diffusion of Copper Wire Bonding
,”
Proceedings of 56th IEEE Electronic Components & Technology Conference
,
San Diego, CA
, May 30–June 2, pp.
1821
1826
.10.1109/ECTC.2006.1645907
21.
Yeoh
,
L. S.
,
2007
, “
Characterization of Intermetallic Growth for Gold Bonding and Copper Bonding on Aluminum Metallization in Power Transistors
,”
Proceedings of 9th IEEE Electronic Packaging Technology Conference
,
Singapore
, December 10–12, pp.
731
736
.10.1109/EPTC.2007.4469709
22.
England
,
L.
, and
Jiang
,
T.
,
2007
, “
Reliability of Cu Wire Bonding to Al Metallization
,”
Proceedings of 57th Electronic Component Technolog Conference
,
Reno, NV
, May 29–June 1, pp.
1604
1613
.10.1109/ECTC.2007.374009
23.
Kaimori
,
S.
,
Nonaka
,
T.
, and
Mizoguchi
,
A.
,
2006
, “
The Development of Cu Bonding Wire With Oxidation-Resistant Metal Coating
,”
IEEE Trans. Adv. Packag.
,
29
(
2
), pp.
227
231
.10.1109/TADVP.2006.872999
24.
Murali
,
S.
, and
Srikanth
,
N.
,
2006
, “
Acid Decapsulation of Epoxy Molded IC Packages With Copper Wire Bonds
,”
IEEE Trans. Electron. Packag. Manuf.
,
29
(
3
), pp.
179
183
.10.1109/TEPM.2006.882499
25.
Chylak
,
R.
,
2009
, “
Developments in Fine Pitch Copper Wire Bonding Production
,”
Proceedings of 11th IEEE Electronics Packaging and Technology Conference
,
Singapore
, December 9–11, pp.
1
6
.10.1109/EPTC.2009.5416582
26.
Appelt
,
B.
,
Tseng
,
A.
, and
Lai
,
Y.
,
2009
, “
Fine Pitch Copper Wire Bonding—Why Now?
,”
Proceedings of 11th IEEE Electronics Packaging and Technology Conference
,
Singapore
, December 9–11, pp.
469
472
.10.1109/EPTC.2009.5416500
27.
Yauw
,
O.
,
Clauberg
,
H.
,
Lee
,
K.
,
Shen
,
L.
, and
Chylak
,
B.
,
2010
, “
Wire Bonding Optimization With Fine Copper Wire for Volume Production
,”
Proceedings of 12th IEEE Electronics Packaging and Technology Conference
, Singapore, December 8–10, pp.
467
472
.10.1109/EPTC.2010.5702685
28.
Leng
,
E.
,
Siong
,
C.
,
Seong
,
L.
,
Leong
,
P.
,
Gunase
,
K.
,
Song
,
J.
,
Mock
,
K.
,
Siew
,
C.
, and
Siva
,
K.
,
2010
, “
Ultra Fine Pitch Cu Wire Bonding on C45 Ultra Low k Wafer Technology
,”
Proceedings of 12th IEEE Electronics Packaging and Technology Conference
, Singapore, December 8–10, pp.
484
488
.10.1109/EPTC.2010.5702688
29.
Teo
,
J.
,
2010
, “
17.5 μm Thin Cu Wire Bonding for Fragile Low-K Wafer Technology
,”
Proceedings of IEEE Electronics Packaging and Technology Conference
, Singapore, December 8–10, pp.
355
358
.10.1109/EPTC.2010.5702662
30.
Kim
,
S.
,
Park
,
J.
,
Hong
,
S.
, and
Moon
,
J.
,
2010
, “
The Interface Behavior of the Cu-Al Bond System in High Humidity Conditions
,”
Proceedings of 12th IEEE Electronics Packaging and Technology Conference
, Singapore, December 8–10, pp.
545
549
.10.1109/EPTC.2010.5702699
31.
Song
,
M.
,
Gong
,
G.
,
Yao
,
J.
,
Xu
,
S.
,
Lee
,
S.
,
Han
,
M.
, and
Yan
,
B.
,
2010
, “
Study of Optimum Bond Pad Metallization Thickness for Copper Wire Bond Process
,”
Proceedings of 12th IEEE Electronics Packaging and Technology Conference
, Singapore, December 8–10, pp.
597
602
.10.1109/EPTC.2010.5702708
32.
Boettcher
,
T.
,
Rother
,
M.
,
Liedtke
,
S.
,
Ullrich
,
M.
,
Bollmann
,
M.
,
Pinkernelle
,
A.
,
Gruber
,
D.
,
Funke
,
H.
,
Kaiser
,
M.
,
Lee
,
K.
,
Li
,
M.
,
Leung
,
K.
,
Li
,
T.
,
Farrugia
,
M.
, and
O'Halloran
,
O.
,
2010
, “
On the Intermetallic Corrosion of Cu-Al Wire Bonds
,”
Proceedings of 12th IEEE Electronics Packaging and Technology Conference
, Singapore, December 8–10, pp.
585
590
.10.1109/EPTC.2010.5702706
33.
Tang
,
L.
,
Ho
,
H.
,
Zhang
,
Y.
,
Lee
,
Y.
, and
Lee
,
C.
,
2010
, “
Investigation of Palladium Distribution on the Free Air Ball of Pd-Coated Cu Wire
,”
Proceedings of 12th IEEE Electronics Packaging and Technology Conference
, Singapore, December 8–10, pp.
777
782
.10.1109/EPTC.2010.5702754
34.
Kumar
,
B.
,
Sivakumar
,
M.
,
Malliah
,
R.
,
Li
,
M.
, and
Yew
,
S.
,
2010
, “
Process Characterization of Cu & Pd Coated Cu Wire Bonding on Overhang Die: Challenges and Solution
,”
Proceedings of 12th IEEE Electronics Packaging and Technology Conference
, Singapore, December 8–10, pp.
859
867
.10.1109/EPTC.2010.5702710
35.
Breach
,
C.
,
Shen
,
N.
,
Mun
,
T.
,
Lee
,
T.
, and
Holliday
,
R.
,
2010
, “
Effects of Moisture on Reliability of Gold and Copper Ball Bonds
,”
Proceedings of 12th IEEE Electronics Packaging and Technology Conference
, Singapore, December 8–10, pp.
44
51
.10.1109/EPTC.2010.5702603
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