The pull force and displacement of gold (Au) and copper (Cu) wires in microelectronics are investigated in this study. Emphasis is placed on (1) the development of a set of equations for determining the internal forces and deformations of wires when subjected to an external pull force, (2) the determination of the maximum pull force (when the wire breaks) based on some failure criteria of the wires, and (3) the experimental verification of the present equations.
Pull Force and Displacement of Cu/Au Wire Interconnects
Electronics & Optoelectronics Research Laboratory,
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the Journal of Electronic Packaging. Manuscript received May 16, 2011; final manuscript received May 22, 2012; published online August 29, 2012. Assoc. Editor: Cemal Basaran.
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Lau, J., Wu, S., and Lau, J. M. (August 29, 2012). "Pull Force and Displacement of Cu/Au Wire Interconnects." ASME. J. Electron. Packag. December 2012; 134(4): 041002. https://doi.org/10.1115/1.4007233
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