This investigation is aimed at the modeling of both the fabrication process and the reliability of press-fit interconnections on moulded interconnect devices (MID). These are multifunctional three-dimensional substrates, produced by thermoplastic injection moulding for large-series applications. The assembly process and subsequently the durability of press-fit interconnections has been modeled and proved with a finite element software. Especially, a simulation tool for process optimizations was created and applied. In order to obtain realistic results, a creep model for the investigated base material, a liquid-crystal polymer (LCP), was generated and verified by experiments. Required friction coefficients between metal pin and base material were determined by adapting simulations and experiments. Retention forces of pins pressed into substrate holes during as well after the assembly process, and after temperature loads were predicted by simulations. Additionally, the decreasing extraction forces over time due to creep in the thermoplastic base material have been predicted for different storage temperatures as well with finite element analyses. Following, the numerical results of the process and reliability modeling were verified by experiments. It is concluded that the behavior of the mechanical contact of the pin-substrate system, can be suitably described time- and temperature-dependent.
Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected Devices
Laboratory for Assembly and Packaging,
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received April 21, 2011; final manuscript received March 4, 2012; published online July 18, 2012. Assoc. Editor: Stephen McKeown.
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Fellner, T., Zukowski, E., Wilde, J., Kück, H., Richter, H., Schober, M., and Buckmüller, P. (July 18, 2012). "Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected Devices." ASME. J. Electron. Packag. September 2012; 134(3): 031002. https://doi.org/10.1115/1.4006927
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