Accelerated temperature and voltage stress tests were conducted on embedded planar capacitors with epoxy–BaTiO3 composite dielectric. The failure modes were found to be a sudden increase in the leakage current across the capacitor dielectric and a gradual decrease in the capacitance. The failure mechanisms associated with these failure modes were investigated by performing data analysis and failure analysis. The time-to-failure as a result of a sudden increase in the leakage current was modeled using the Prokopowicz equation. The values of constants of the Prokopowicz equation, n and Ea, were determined for the epoxy–BaTiO3 composite. The degradation in capacitance was modeled by performing regression analysis. The time-to-failure and degradation models can be used for the qualification tests of embedded planar capacitors, for the development of new composite dielectric materials, and to improve the manufacturing processes of these capacitors.

References

1.
Rao
,
Y.
,
Yue
,
J.
, and
Wong
,
C.
, 2002, “
Material Characterization of High Dielectric Constant Polymer-Ceramic Composite for Embedded Capacitor to RF Application
,”
Act. Passive Electron. Compon.
,
25
, pp.
123
129
.
2.
Alam
,
M.
,
Azarian
,
M. H.
,
Osterman
,
M.
, and
Pecht
,
M.
, 2010, “
Effectiveness of Embedded Capacitors in Reducing the Number of Surface Mount Capacitors for Decoupling Applications
,”
Circuit World
,
36
(
1
), pp.
22
30
.
3.
Piasecki
,
T.
,
Nitsch
,
K.
,
Dziedzic
,
A.
,
Chabowski
,
K.
,
Stepniewski
,
W.
, and
Koziol
,
G.
, 2011, “
Testing of Passive Elements Embedded in PCB Using Impedance Spectroscopy
,
IMAPS-CPMT Conference
, pp.
51
54
.
4.
Dziedzic
,
A.
,
Klossowicz
,
A.
,
Winiarski
,
P.
,
Nitsch
,
K.
,
Piasecki
,
T.
,
Koziol
,
G.
, and
Steplewski
,
W.
, 2011, “
Chosen Electrical and Stability Properties of Passive Components Embedded in Printed Circuit Boards
,”
Electr. Rev.
,
87
(
10
), pp.
39
44
.
5.
Majek
,
I.
,
Kertesz
,
P.
,
Mazeau
,
J.
,
Chastas
,
D.
,
Lavrier
,
B.
,
Bechou
,
L.
, and
Ousten
,
Y.
, 2011, “
Operational Performances Demonstration of Polymer-Ceramic Embedded Capacitors for MMIC Applications
,”
IEEE Trans. Compon., Packag., Manuf. Technol.
,
1
, pp.
1473
1479
.
6.
Madou
,
A.
, and
Martens
,
L.
, 2001, “
Electrical Behavior of Decoupling Capacitors Embedded in Multilayered PCBs
,”
IEEE Trans. Electromagn. Compat.
,
43
(
4
), pp.
549
556
.
7.
Ulrich
,
R.
, and
Schaper
,
L.
, 2003,
Integrated Passive Component Technology
,
Wiley-IEEE Press
,
Hoboken, NJ
.
8.
Reboun
,
J.
, and
Hamacek
,
A.
, 2011, “
Capacitors Embedded in Photovia Substrates
,”
International Spring Seminar on Electronics Technology
, pp.
12
16
.
9.
Swartz
,
S.
, 1990, “
Topics in Electronic Ceramics
,”
IEEE Trans. Electr. Insul.
,
25
(
5
), pp.
935
987
.
10.
Keimasi
,
M.
,
Azarian
,
M. H.
, and
Pecht
,
M.
, 2008, “
Flex Cracking of Multilayer Ceramic Capacitors Assembled With Pb-Free and Tin-Lead Solders
,”
IEEE Trans. Device Mater. Reliab.
,
8
(
1
), pp.
182
192
.
11.
Xu
,
J.
,
Bhattacharya
,
S.
,
Pramanik
,
P.
, and
Wong
,
C.
, 2006, “
High Dielectric Constant Polymer-Ceramic (Epoxy-Varnish-Barium Titanate) Nanocomposites at Moderate Filler Loadings for Embedded Capacitors
,”
J. Electron. Mater.
,
35
(
11
), pp.
2009
2015
.
12.
Imanaka
,
Y.
,
Amada
,
H.
, and
Kumasaka
,
F.
, 2011, “
Microstructure and Dielectric Properties of Composite Films for Embedded Capacitor Applications
,”
Int. J. Appl. Ceram. Technol.
,
8
, pp.
653
657
.
13.
Chen
,
Y.
,
Liu
,
S.
,
Hung
,
C.
,
Chen
,
M.
, and
Wang
,
W.
, 2011, “
Electrical and Ageing Characterization of Organic Capacitive Substrate
,”
Electronic Components and Technology Conference
,
Lake Buena Vista
,
FL
, pp.
1805
1810
.
14.
Wada
,
S.
,
Hoshina
,
T.
,
Yasuno
,
H.
,
Nam
,
S.
,
Kakemoto
,
H.
,
Tsurumi
,
T.
, and
Yashima
,
M.
, 2005, “
Size Dependence of Dielectric Properties for nm-Sized Barium Titanate Crystallites and Its Origin
,”
J. Korean Phys. Soc.
,
46
(
1
), pp.
303
307
.
15.
Chiang
,
Y.
,
Birnie
,
D.
, II
, and
Kingery
,
W.
, 1997,
Physical Ceramics: Principles for Ceramic Science and Engineering
,
John Wiley and Sons
,
Hoboken, NJ
.
16.
Yoon
,
D.
,
Zhang
,
J.
, and
Lee
,
B.
, 2003, “
Dielectric Constant and Mixing Model of BaTiO3 Composite Thick Films
,”
Mater. Res. Bull.
,
38
, pp.
765
772
.
17.
Jang
,
K.
, and
Paik
,
K.
, 2008, “
Screen Printable Epoxy/BaTiO3 Embedded Capacitor Pastes With High Dielectric Constant for Organic Substrate Applications
,”
J. Appl. Polym. Sci.
,
110
, pp.
798
807
.
18.
Rao
,
Y.
,
Qu
,
J.
,
Marinis
,
T.
, and
Wong
,
C.
, 2000, “
A Precise Numerical Prediction of Effective Dielectric Constant for Polymer-Ceramic Composite Based on Effective-Medium Theory
,”
IEEE Trans. Compon. Packag. Technol.
,
23
(
4
), pp.
680
683
.
19.
Xu
,
J.
,
Bhattacharya
,
S.
,
Moon
,
K.
,
Lu
,
J.
,
Englert
,
B.
, and
Wong
,
C.
, 2006, “
Large-Area Processable High K Nanocomposite-Based Embedded Capacitors
,”
Electronic Components and Technology Conference
,
San Diego
,
CA
, pp.
1520
1532
.
20.
Jayasundere
,
N.
, and
Smith
,
B.
, 1993, “
Dielectric Constant of Binary Piezo-Electric 0–3 Composites
,”
J. Appl. Phys.
,
73
, pp.
2462
2466
.
21.
Paik
,
K.
,
Hyun
,
J.
,
Lee
,
S.
, and
Jang
,
K.
, 2006, “
Epoxy/BaTiO3 (SrTiO3) Composite Films and Pastes for High Dielectric Constant and Low Tolerance Embedded Capacitors in Organic Substrates
,”
1st Electronics Systemintegration Technology Conference
,
Dresden
,
Germany
, Vol.
2
, pp.
794
801
.
22.
Xu
,
J.
,
Moon
,
K.
,
Pramanik
,
P.
,
Bhattacharya
,
S.
, and
Wong
,
C.
, 2007, “
Optimization of Epoxy–Barium Titanate Nanocomposites for High Performance Embedded Capacitor Components
,”
IEEE Trans. Compon. Packag. Technol.
,
30
(
2
), pp.
248
253
.
23.
Alam
,
M.
,
Azarian
,
M.
, and
Pecht
,
M.
, 2012, “
Reliability of Embedded Planar Capacitors With Epoxy–BaTiO3 Composite Dielectric During Temperature-Humidity-Bias Tests
,”
IEEE Trans. Device Mater. Reliab.
,
12
(
1
), pp.
86
93
.
24.
Alam
,
M.
,
Azarian
,
M.
, and
Pecht
,
M.
, “
Effects of Moisture Absorption on the Electrical Parameters of Embedded Capacitors With Epoxy–BaTiO3 Nanocomposite Dielectric
,”
J. Mater. Sci.: Mater. Electron.
(to be published).
25.
Rawal
,
B.
, and
Chan
,
N.
, “
Conduction and Failure Mechanisms in Barium Titanate Based Ceramics Under Highly Accelerated Conditions
,” AVX Technical Report, Myrtle Beach, SC.
26.
Minford
,
W.
, 1982, “
Accelerated Life Testing and Reliability of High K Multilayer Ceramic Capacitors
,”
IEEE Trans. Compon., Hybrids, Manuf. Technol.
,
Chmt-5
(
3
), pp.
297
300
.
27.
Lee
,
H.
, and
Burton
,
L.
, 1986, “
Charge Carriers and Time Dependent Currents in BaTiO3-Based Ceramic
,”
IEEE Trans. Compon., Hybrids, Manuf. Technol.
,
CHMT-9
(
4
), pp.
469
474
.
28.
Kishi
,
H.
,
Mizuno
,
Y.
, and
Chazono
,
H.
, 2003, “
Base-Metal Electrode-Multilayer Ceramic Capacitors: Past, Present and Future Perspectives
,”
Jpn. J. Appl. Phys.
,
42
(
1
), pp.
1
15
.
29.
Prokopowicz
,
T.
, and
Vaskas
,
A.
, 1969, “
Research and Development, Intrinsic Reliability, Subminiature Ceramic Capacitors
,” Final Report Nos. ECOM-90705-F and NTIS AD-864068,
175
pp.
30.
Yamamatsu
,
J.
,
Kawano
,
N.
,
Arashi
,
T.
,
Sato
,
A.
,
Nakano
,
Y.
, and
Nomura
,
T.
, 1996, “
Reliability of Multilayer Ceramic Capacitors With Nickel Electrodes
,”
J. Power Sources
,
60
, pp.
199
203
.
31.
Yoo
,
I.
,
Burton
,
L.
, and
Stephenson
,
F.
, 1987, “
Electrical Conduction Mechanisms of Barium-Titanate-Based Thick-Film Capacitors
,”
IEEE Trans. Compon., Hybrids, Manuf. Technol.
,
CHMT-10
(
2
), pp.
274
282
.
32.
Paulsen
,
J.
, and
Reed
,
E.
, 2002, “
Highly Accelerated Life Testing of Base-Metal-Electrode Ceramic Chip Capacitors
,”
Microelectron. Reliab.
,
42
, pp.
815
520
.
33.
Maher
,
G.
,
Prokopowicz
,
T.
, and
Bheemineni
,
V.
, 1993, “
High Volumetric Low Fired X7R MLC Capacitor
,”
43rd Proceedings of Electronics Components and Technology Conference
,
Orlando
,
FL
, pp.
280
284
.
34.
Randall
,
M.
,
Gaurav
,
A.
,
Skamser
,
D.
, and
Beeson
,
J.
, 2003, “
Lifetime Modeling of Sub 2 Micron Dielectric Thickness BME MLCC
,”
Capacitor and Resistor Technology Symposium
,
Scottsdale
,
AZ
, pp.
1
7
.
35.
Donahoe
,
D.
,
Pecht
,
M.
,
Lloyd
,
I.
, and
Ganesan
,
S.
, 2006, “
Moisture Induced Degradation of Multilayer Ceramic Capacitors
,”
Microelectron. Reliab.
,
46
, pp.
400
408
.
36.
Cho
,
H.
,
Cho
,
S.
,
Jo
,
J.
,
Seo
,
H.
,
Kim
,
B.
, and
Yoo
,
J.
, 2008, “
Highly Reliable Processes for Embedding Discrete Passive Components Into Organic Substrates
,”
Microelectron. Reliab.
,
48
(
5
), pp.
739
743
.
37.
Mitoseriu
,
L.
,
Tura
,
V.
,
Curteanu
,
M.
,
Popovici
,
D.
, and
Anghel
,
A.
, 2001, “
Aging Effects in Pure and Doped Barium Titanate Ceramics
,”
IEEE Trans. Dielectr. Electr. Insul.
,
8
(
3
), pp.
500
506
.
38.
Alam
,
M. A.
,
Azarian
,
M. H.
,
Osterman
,
M.
, and
Pecht
,
M.
, 2011, “
Temperature and Voltage Stress Effects on Leakage Current Mechanism in Epoxy–Barium Titanate Composite Dielectric Used in Embedded Capacitors
,”
Microelectron. Reliab.
,
51
(
5
), pp.
946
952
.
39.
Simamoto
,
S.
,
Sakata
,
Y.
,
Kojima
,
J.
,
Kume
,
N.
, and
Tsujimoto
,
Y.
, 1992, “
Lacquered Polymer-Ceramic Composite Dielectric Film for Capacitors
,”
IEEE International Symposium on Electrical Insulation
,
Baltimore
,
MD
, pp.
140
143
.
40.
Windlass
,
H.
,
Raj
,
P.
,
Balaraman
,
D.
,
Bhattacharya
,
S.
, and
Tummala
,
R.
, 2003, “
Colloidal Processing of Polymeric Ceramic Nanocomposite Integral Capacitors
,”
IEEE Trans. Electron. Packag. Manuf.
,
26
(
2
), pp.
100
105
.
41.
Ogitani
,
S.
,
Allen
,
S.
, and
Kohl
,
P.
, 2000, “
Factors Influencing the Permittivity of Polymer/Ceramic Composites for Embedded Capacitors
,”
IEEE Trans. Adv. Packag.
,
23
(
2
), pp.
313
322
.
42.
Andresakis
,
J.
,
Yamamoto
,
T.
, and
Biunno
,
N.
, 2003, “
New Non-Reinforced Substrates for Use as Embedded Capacitors
,”
Circuit World
,
30
(
1
), pp.
36
41
.
43.
Alam
,
M.
,
Azarian
,
M. H.
,
Osterman
,
M.
, and
Pecht
,
M.
, 2009, “
Reliability of Embedded Planar Capacitors Under Temperature and Voltage Stress
,”
Proceedings of Capacitor and Resistor Technology Symposium
,
Jacksonville
,
FL
.
44.
Jang
,
K.
, and
Paik
,
K.
, 2006, “
A Study on Epoxy/BaTiO3 Embedded Capacitor Pastes for Organic Substrates
,”
Electronic Components and Technology Conference
,
San Diego
,
CA
, pp.
1504
1509
.
45.
Bowles
,
P.
, and
Charbonneau
,
R.
, 1999, “
An Overview of the NCMS/StorageTek Embedded Decoupling Capacitance Project
,”
International Symposium on Advanced Packaging Materials: Process, Properties, and Interfaces
,
Braselton
,
GA
, pp.
191
196
.
46.
Alam
,
M.
,
Azarian
,
M.
,
Osterman
,
M.
, and
Pecht
,
M.
, 2011, “
Prognostics of Failures in Embedded Planar Capacitors Using Model-Based and Data-Driven Approaches
,”
J. Intell. Mater. Syst. Struct.
,
22
, pp.
1293
1304
.
47.
Roy
,
M.
,
Nelson
,
J.
,
MacCrone
,
R.
,
Schadler
,
L.
,
Reed
,
C.
,
Keefe
,
R.
, and
Zenger
,
W.
, 2005, “
Polymer Nanocomposite Dielectrics—The Role of the Interface
,”
IEEE Trans. Dielectr. Electr. Insul.
,
12
(
4
), pp.
629
643
.
48.
Alam
,
M. A.
,
Azarian
,
M. H.
,
Osterman
,
M.
, and
Pecht
,
M.
, 2011, “
Failure Mechanisms in Embedded Planar Capacitors During High Temperature Operating Life (HTOL) Testing
,”
IPC APEX EXPO
,
Las Vegas
,
NV
.
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