Demand for long-term reliability of electronic packaging has lead to a large number of studies on viscoplastic behavior of solder alloys. Various creep models for solder alloys have been proposed. They range from purely empirical to mechanism based models where dislocation motion and diffusion processes are taken into account. In this study, most commonly used creep models are compared with the test data and implemented in ABAQUS to compare their performance in cycling loading. Finally, a new creep model is proposed that combines best features of many models. It is also shown that, while two creep models may describe the same material stress–strain rate curves equally well, they may yield very different results when utilized for cycling loading. One interesting observation of this study is that the stress exponent, n., also depends on the grain size.
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December 2011
Technical Briefs
A Creep Model for Solder Alloys
Yongchang Lee,
Yongchang Lee
Electronic Packaging Laboratory, Department of Civil, Structural, and Environmental Engineering,
State University of New York at Buffalo,Buffalo, NY 14260; Nanotechnology Research Laboratory,University of Tabuk
, Tabuk, Dhiba, 71421, Saudi Arabia
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Cemal Basaran
Cemal Basaran
Electronic Packaging Laboratory,
State University of New York at Buffalo
Search for other works by this author on:
Yongchang Lee
Electronic Packaging Laboratory, Department of Civil, Structural, and Environmental Engineering,
State University of New York at Buffalo,Buffalo, NY 14260; Nanotechnology Research Laboratory,University of Tabuk
, Tabuk, Dhiba, 71421, Saudi Arabia
Cemal Basaran
Electronic Packaging Laboratory,
State University of New York at Buffalo
J. Electron. Packag. Dec 2011, 133(4): 044501 (6 pages)
Published Online: November 17, 2011
Article history
Received:
December 1, 2009
Revised:
July 12, 2011
Online:
November 17, 2011
Published:
November 17, 2011
Citation
Lee, Y., and Basaran, C. (November 17, 2011). "A Creep Model for Solder Alloys." ASME. J. Electron. Packag. December 2011; 133(4): 044501. https://doi.org/10.1115/1.4005288
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