When two thin plates or layers are bonded together, an extremely thin bond layer of third material exists between the two layers. This research work examines the effect of bond layer on the interfacial shearing and peeling stresses in a bimaterial model. Earlier papers on this topic are based on several mutually contradictory expressions for the shear compliance of the bond layer. This paper is aimed at resolving this ambiguity and presents derivation of shear compliance on a rational basis. A numerical example is carried out for a silicon-copper system with a gold-tin solder bond layer. The results obtained are likely to be useful in interfacial stress evaluation and physical design of bimaterial assemblies used in microelectronics and photonics applications.

References

References
1.
Sergent
,
J. E.
, and
Krum
,
A.
, 1998,
Thermal Management Handbook
(
McGraw-Hill
,
New York
), p.
1.1
.
2.
Wang
,
W. C.
, and
Hsu
,
J. S.
, 2004, “
Re-Examination on Thermal Stresses of Bonded Structures
,”
J. Strain Anal. Eng. Des.
,
39
(
3
), pp.
261
270
.
3.
Vujosevic
,
M.
, 2008, “
Thermally Induced Deformations in Die-substrate Assembly
,”
Theor. Appl. Mech.
,
35
(
1–3
), pp.
305
322
.
4.
Timoshenko
,
S.
, 1925, “
Analysis of Bi-Metal Thermostats
,”
J. Opt. Soc. Am.
,
11
, pp.
233
255
.
5.
Chen
,
W. T.
, and
Nelson
,
C. W.
, 1979, “
Thermal Stressses in Bolted Joints
,”
IBM J. Res. Dev.
,
23
, pp.
178
188
.
6.
Suhir
,
E.
, 1986, “
Stresses in Bimetal Thermostats
,”
ASME J. Appl. Mech.
,
53
, pp.
657
660
.
7.
Suhir
,
E.
, 1989, “
Interfacial Stresses in Bimetal Thermostats
,”
ASME J. Appl. Mech.
,
56
, pp.
595
600
.
8.
Matthys
,
L.
, and
Mey
,
G. D.
, 1996, “
An Analysis of an Engineering Model for the Thermal Mismatch Stresses at the Interface of a Uniformly Heated Two Layer Structure
,”
Int. J. Electron. Packag.
,
19
(
3
), pp.
323
329
.
9.
Mirman
,
I. B.
, 1991, “
Effects of Peeling Stress in Bimaterial Assembly
,”
ASME J. Electron. Packag.
,
11
, pp.
431
433
.
10.
Moore
,
T. D.
, and
Jarvis
,
J. L.
, 2003, “
A Simple and Fundamental Design Rule for Resisting Delamination in Bimaterial Structures
,”
Microelectron. Reliab.
,
43
, pp.
487
494
.
11.
Moore
,
T. D.
, and
Jarvis
,
J. L.
, 2004, “
The Peeling Moment-A Key Rule for Delamination Resistance in I.C. Assemblies
,”
ASME J. Electron. Packag.
,
126
, pp.
106
109
.
12.
Ru
,
C. Q.
, 2002, “
Interfacial Thermal Stresses in Bimaterial Elastic Beams: Modified Beam Models Revisited
,”
ASME J. Electron. Packag.
,
124
(
3
), pp.
141
146
.
13.
Sujan
,
D.
,
Seetharamu
,
K. N.
,
Hassan
,
A. Y.
, and
Murthy
,
M. V. V.
, 2004, “
Engineering Model for Interfacial Stresses of a Heated Bimaterial Structure Used in Electronic Packaging
,”
International Conference
, EMAP, Penang,
Malaysia
, pp.
181
187
.
14.
Sujan
,
D.
,
Murthy
,
M. V. V.
,
Seetharamu
,
K. N.
, and
Hassan
,
A. Y.
, 2005, “
Complete Model for Interfacial Stresses of a Two Layered Structure
,”
6th International Conference, Euro2005
, Berlin,
Germany
, pp.
454
461
.
15.
Suhir
,
E.
, 1986, “
Calculated Thermally Induced Stresses in Adhesively Bonded and Soldered Assemblies
,”
Proceedings of the ISHM International Symposium on Microelectronics
,
Atlanta GA
, pp.
383
392
.
16.
Brown
,
W. D.
, 1999,
Advanced Electronic Packaging
(
IEEE
,
Piscataway, NJ
), pp.
241
266
.
17.
Wei
,
Y.
,
Chow
,
C.
,
Fang
,
H.
, and
Neilsen
,
M.
, 1999, “
Characteristics of Creep Damage for 60Sn-40Pb Solder Material
,” Publication 99-IMECE/EEP-15: ASME, New York, pp.
1
15
.
18.
Yamamoto
,
T.
, and
Tsubone
,
K.-I.
, 2007, “
Assembly Technology Using Lead-free Solder
,”
Fujitsu Sci. Tech. J.
,
43
(
1
), pp.
50
58
.
19.
Too
,
S. S.
,
et al.
, 2009, “
Indium Thermal Interface Material Development for Microprocessors
,” 25th IEEE Semi-Therm Symposium, IEEE, pp.
186
192
.
20.
Wang
,
P. J.
, and
Lee
,
C. C.
, 2010, “
Silver Joints Between Silicon Chips and Copper Substrates Made by Direct Bonding at Low-Temperature
,”
IEEE Trans. Compon. Packag. Technol.
,
33
(
1
), pp.
10
14
.
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