Comprehensive analysis of microelectronic cooling systems utilizing thermoelectric modules is time consuming because it involves solving many parametric equations, which require solving complex mathematical equations or the assistance of an expensive computation-fluid-dynamic software. In this study, a modified-graphical method (MGM) based on a previous study by Lineykin and Ben-Yaakov is proposed to analyze an active cooling system using thermoelectric modules. The MGM provides quicker visualization of the cooling requirement such as the optimum operating currents, temperature of the hot side, and coefficient of performance without the need of using any manufacturer’s proprietary data. In addition, the MGM is designed to analyze a multidimensional-heat-transfer-system utilizing thermoelectric modules (Phan, H., and Agonafer, D., 2010, “Experimental Analysis Model of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers,” ASME J. Electron. Packag. 132(2), p. 024501).

References

References
1.
Choi
,
S.
, and
Eastman
,
J.
, 2001, “
Enhanced Heat Transfer Using Nanofluids
,” U.S. Patent No. 6,221,275.
2.
Pettes
,
A.
,
Hodes
,
M.
, and
Goodson
,
K.
, 2009, “
Optimized Thermoelectric Refrigeration in the Presence of Thermal Boundary Resistance
,”
IEEE Trans. Adv. Packag.
32
(
2
), pp.
423
430
.
3.
Nagy
,
M.
, and
Buist
,
R.
, 1994, “
Effect of Heat Sink Design on Thermoelectric Cooling Performance
,”
13th International Conference on Thermoelectrics
,
Kansas City, Missouri
, August 30–September 1.
4.
Lineykin
,
S.
, and
Ben-Yaakov
,
S.
, 2005, “
Modeling and Analysis of Thermoelectric Modules
,”
Applied Power Electronics Conference
,
APEC
,
Austin, TX
, pp.
2019
2023
.
5.
Lineykin
,
S.
, and
Ben-Yaakov
,
S.
, 2005, “
Analysis of Thermoelectric Coolers by a SPICE-Compatible Equivalent Circuit Model
,”
Power Electron. Lett.
3
(
2
), pp.
63
66
.
6.
Lineykin
,
S.
, and
Ben-Yaakov
,
S.
, 2007, “
User-Friendly and Intuitive Graphical Approach to the Design of Thermoelectric Cooling System
,”
Int. J. Refrig.
30
, pp.
798
804
.
7.
Phan
,
H.
, and
Agonafer
,
D.
, 2010, “
Experimental Analysis Model of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers
,”
ASME J. Electron. Packag.
132
(
2
), p.
024501
.
You do not currently have access to this content.