Significant research has focused on the reliability of through-silicon-vias (TSVs) under conventional uniform thermal loading conditions such as accelerated thermal cycling (0–100 °C) or deep thermal cycling (−40–125 °C). This study analyzes the thermomechanical behavior of TSVs in 3D packages undergoing rapid local temperature fluctuations, as would be experienced in actual operation. A global/local finite element model is used to analyze the TSV behavior at various distances from the thermal fluctuation site. Transient thermal measurements, warpage and in-plane deformation measurements, as well as micro-Raman spectroscopy measurements are used to validate the model. The results reveal that the short term local temperature transients have minimal impact on the TSV stress state regardless of TSV location, implying that global package- induced stresses dominate.
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e-mail: dehaven@us.ibm.com
e-mail: klymko@us.ibm.com
e-mail: shc064@ucsd.edu
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September 2011
Research Papers
Thermo-Mechanical Response of Thru-Silicon Vias Under Local Thermal Transients Using Experimentally Validated Finite Element Models
Patrick W. Dehaven,
Patrick W. Dehaven
Senior Engineer
e-mail: dehaven@us.ibm.com
IBM Corporation
, 2070 Rt. 52, Hopewell Junction, NY 12533
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Nancy R. Klymko,
Nancy R. Klymko
Senior Technical Staff Member
e-mail: klymko@us.ibm.com
IBM Corporation
, 2070 Rt. 52, Hopewell Junction, NY 12533
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Shaochen Chen
e-mail: shc064@ucsd.edu
Shaochen Chen
Professor
University of California San Diego
, 9500 Gilman Drive #0448, La Jolla, CA 92093
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Jamil A. Wakil
Patrick W. Dehaven
Senior Engineer
IBM Corporation
, 2070 Rt. 52, Hopewell Junction, NY 12533e-mail: dehaven@us.ibm.com
Nancy R. Klymko
Senior Technical Staff Member
IBM Corporation
, 2070 Rt. 52, Hopewell Junction, NY 12533e-mail: klymko@us.ibm.com
Shaochen Chen
Professor
University of California San Diego
, 9500 Gilman Drive #0448, La Jolla, CA 92093e-mail: shc064@ucsd.edu
J. Electron. Packag. Sep 2011, 133(3): 031001 (8 pages)
Published Online: September 14, 2011
Article history
Received:
March 31, 2010
Revised:
June 6, 2011
Online:
September 14, 2011
Published:
September 14, 2011
Citation
Wakil, J. A., Dehaven, P. W., Klymko, N. R., and Chen, S. (September 14, 2011). "Thermo-Mechanical Response of Thru-Silicon Vias Under Local Thermal Transients Using Experimentally Validated Finite Element Models." ASME. J. Electron. Packag. September 2011; 133(3): 031001. https://doi.org/10.1115/1.4004656
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