Simplified integrated approaches to thermal modeling of electronics packages call for fast and easy thermal models. However, this is often in contrast with the complexity of the thermal problem to be solved, which prevents the application of simplified approaches. After a review of the available modeling strategies, steady state thermal analysis of a typical stacked ball grid array package based on a thermal resistance network is presented. The physical model is discussed in detail, together with its advantages and limitations. The results have been compared with detailed 3D-simulations performed by means of a commercial code: for thermal design purposes, the accuracy is satisfactorily, leading a prediction error of the junction temperature lower than 10%.
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June 2011
Research Papers
Simplified Thermal Model of a Stacked Ball Grid Array Package
Luigi P. M. Colombo,
Luigi P. M. Colombo
Department of Energy,
e-mail: luigi.colombo@polimi.it
Politecnico di Milano
, Via Lambruschini 4, 20156 Milano, Italy
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Davide Paleari
Davide Paleari
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Luigi P. M. Colombo
Department of Energy,
Politecnico di Milano
, Via Lambruschini 4, 20156 Milano, Italy
e-mail: luigi.colombo@polimi.it
Alexey Petrushin
Davide Paleari
J. Electron. Packag. Jun 2011, 133(2): 021006 (7 pages)
Published Online: June 23, 2011
Article history
Received:
July 23, 2010
Revised:
April 5, 2011
Online:
June 23, 2011
Published:
June 23, 2011
Citation
Colombo, L. P. M., Petrushin, A., and Paleari, D. (June 23, 2011). "Simplified Thermal Model of a Stacked Ball Grid Array Package." ASME. J. Electron. Packag. June 2011; 133(2): 021006. https://doi.org/10.1115/1.4003991
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