Carbon nanotube (CNT) arrays can be effective thermal interface materials with high compliance and conductance over a wide temperature range. Here, we study CNT interface structures in which free CNT ends are bonded using Pd hexadecanethiolate, Pd(SC16H35)2, to an opposing substrate (one-sided interface) or opposing CNT array (two-sided interface) to enhance contact conductance while maintaining a compliant joint. The Pd weld is particularly attractive for its mechanical stability at high temperatures. A transient photoacoustic (PA) method is used to measure the thermal resistance of the palladium-bonded CNT interfaces. The interfaces were bonded at moderate pressures and then tested at 34 kPa using the PA technique. At an interface temperature of approximately 250°C, one-sided and two-sided palladium-bonded interfaces achieved thermal resistances near 10 mm2 K/W and 5 mm2 K/W, respectively.
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e-mail: stephen.l.hodson@gmail.com
e-mail: bhuv.02@gmail.com
e-mail: cola@gatech.edu
e-mail: xxu@purdue.edu
e-mail: kulkarni@jncasr.ac.in
e-mail: tsfisher@purdue.edu
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June 2011
Carbon Nanotubes
Palladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces
Stephen L. Hodson,
e-mail: stephen.l.hodson@gmail.com
Stephen L. Hodson
School of Mechanical Engineering and Birck Nanotechnology Center, Purdue University
, West Lafayette, IN 47907
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Thiruvelu Bhuvana,
e-mail: bhuv.02@gmail.com
Thiruvelu Bhuvana
Birck Nanotechnology Center
, West Lafayette, IN 47907; Jawaharlal Nehru Centre for Advanced Scientific Research, Bangalore, India
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Baratunde A. Cola,
e-mail: cola@gatech.edu
Baratunde A. Cola
George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology
, Atlanta, GA 30332
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Xianfan Xu,
Xianfan Xu
School of Mechanical Engineering and Birck Nanotechnology Center,
e-mail: xxu@purdue.edu
Purdue University
, West Lafayette, IN 47907
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G. U. Kulkarni,
e-mail: kulkarni@jncasr.ac.in
G. U. Kulkarni
Jawaharlal Nehru Centre for Advanced Scientific Research
, Bangalore, India
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Timothy S. Fisher
Timothy S. Fisher
School of Mechanical Engineering and Birck Nanotechnology Center,
e-mail: tsfisher@purdue.edu
Purdue University
, West Lafayette, IN 47907
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Stephen L. Hodson
School of Mechanical Engineering and Birck Nanotechnology Center, Purdue University
, West Lafayette, IN 47907e-mail: stephen.l.hodson@gmail.com
Thiruvelu Bhuvana
Birck Nanotechnology Center
, West Lafayette, IN 47907; Jawaharlal Nehru Centre for Advanced Scientific Research, Bangalore, India
e-mail: bhuv.02@gmail.com
Baratunde A. Cola
George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology
, Atlanta, GA 30332e-mail: cola@gatech.edu
Xianfan Xu
School of Mechanical Engineering and Birck Nanotechnology Center,
Purdue University
, West Lafayette, IN 47907e-mail: xxu@purdue.edu
G. U. Kulkarni
Jawaharlal Nehru Centre for Advanced Scientific Research
, Bangalore, India
e-mail: kulkarni@jncasr.ac.in
Timothy S. Fisher
School of Mechanical Engineering and Birck Nanotechnology Center,
Purdue University
, West Lafayette, IN 47907e-mail: tsfisher@purdue.edu
J. Electron. Packag. Jun 2011, 133(2): 020907 (6 pages)
Published Online: June 23, 2011
Article history
Received:
December 1, 2009
Revised:
January 13, 2011
Online:
June 23, 2011
Published:
June 23, 2011
Citation
Hodson, S. L., Bhuvana, T., Cola, B. A., Xu, X., Kulkarni, G. U., and Fisher, T. S. (June 23, 2011). "Palladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces." ASME. J. Electron. Packag. June 2011; 133(2): 020907. https://doi.org/10.1115/1.4004094
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