Relatively little information is available on the growth patterns of gold aluminide compound in accurate 3D measurement as compared with 2D images of the projected surface. A 3D surface imaging technique by using infinite focus microscope (IFM) was proposed in this study to observe and explain the effects of bonding parameters on growth pattern of gold aluminide compound formed between a 25.48μm 4N gold wire and an aluminum pad metallization. Two bonding factors, which were varied, were ball bonding force and ultrasonic current while bonding time and temperature were kept constant. The 3D surface measurement provides topographical and color information of the bonded region, which indicates that optimum bonding condition has a significant effect on uniform growth and wide coverage area of gold aluminide compound. Results illustrated by this technique were used as additional information to the results produce by the conventional methods such as cross section optical image and scanning electron microscope (SEM) micrographs, to gain a better understanding on the physical behavior of gold aluminide compound.

1.
Harman
,
G. G.
, 1997,
Wire Bonding in Microelectronics, Materials, Processes, Reliability and Yield
,
2nd ed.
,
McGraw-Hill
,
New York
.
2.
Murali
,
S.
, 2006, “
Formation and Growth of Intermetallics in Thermosonic Wire Bonds: Significance of Vacancy–Solute Binding Energy
,”
J. Alloys Compd.
0925-8388,
426
, pp.
200
204
.
3.
Jun-Hui
,
L.
,
Lei
,
H.
, and
Jue
,
Z.
, 2004, “
Studies of Microstructure Characteristic and Evolutions at the Bond Interfaces in Bonding Technology
,”
IEEE Proceedings of the HDP
, pp.
316
321
.
4.
Philofsky
,
E.
, 1970, “
Intermetallic Formation in Gold-Aluminum Systems
,”
Solid-State Electron.
0038-1101,
13
, pp.
1391
1394
.
5.
Breach
,
C. D.
,
Wuff
,
F.
,
Dittmer
,
K.
,
Garnier
,
M.
,
Boillot
,
V.
, and
Tok
,
C. W.
, 2004, “
Reliability and Failure Analysis of Gold Ball Bonds in Fine and Ultra-Fine Pitch Applications
,”
Proceedings of the Semicon Technical Symposium
, Singapore, pp.
78
87
.
6.
Breach
,
C. D.
,
Tok
,
C. W.
,
Wuff
,
F.
, and
Calpito
,
D.
, 2004, “
Degradation of the Au4Al Compound in Gold During Isothermal Aging in Air at 175°C
,”
J. Mater. Sci.
0022-2461,
39
, pp.
6125
6128
.
7.
Klengel
,
R.
,
Knoll
,
H.
,
Petzold
,
M.
,
Wohnig
,
M.
, and
Schrapler
,
L.
, 2006, “
Intermetallic Compound Formation in Au/Al Thermosonic Wire Bonding During High Temperature Annealing at 150°C as a Function of Wire Material
,”
Proceedings of the Electronics System Integration Technology Conference
, Germany, pp.
370
375
.
8.
Murali
,
S.
,
Srikanth
,
N.
, and
Vath
,
C. J.
, III
, 2003, “
An Analysis of Intermetallics Formation of Gold and Copper Ball Bonding on Thermal Aging
,”
Mater. Res. Bull.
0025-5408,
38
, pp.
637
646
.
9.
Murali
,
S.
,
Srikanth
,
N.
, and
Vath
,
C. J.
, III
, 2004, “
Effect of Wire Size on the Formation of Intermetallics and Kirkendall Voids on Thermal Aging of Thermosonic Wire Bonds
,”
Mater. Lett.
0167-577X,
58
, pp.
3096
3101
.
10.
Chang
,
H. S.
,
Hsieh
,
K. C.
,
Martens
,
T.
, and
Yang
,
A.
, 2004, “
Wire-Bond Void Formation During High Temperature Aging
,”
IEEE Trans. Compon. Packag. Technol.
1521-3331,
27
, pp.
155
160
.
11.
Lin
,
T. Y.
,
Davison
,
K. L.
,
Leong
,
W. S.
,
Chua
,
S.
,
Yao
,
Y. F.
,
Pan
,
J. S.
,
Chai
,
J. W.
,
Toh
,
K. C.
, and
Tiju
,
W. C.
, 2003, “
Surface Topographical Characterization of Silver-Plated Film on the Wedge Bondability of Leaded IC Packages
,”
Microelectron. Reliab.
0026-2714,
43
, pp.
803
809
.
12.
Levine
,
L.
,
Osborne
,
M.
, and
Keller
,
F.
, 2004, “
Guidelines for Improving Intermetallic Reliability
,”
International Electronics Manufacturing Technology Symposium
, San Jose, pp.
174
176
.
13.
Wulff
,
F.
,
Breach
,
C. D.
,
Stephan
,
D.
,
Saraswati
, and
Dittmer
,
K.
, 2004, “
Characterization of Intermetallic Growth in Copper and Gold Ball Bonds on Aluminium Metallization
,”
Proceedings of the Electronics Packaging Technology Conference
, pp.
348
353
.
14.
Dittmer
,
K.
,
Kumar
,
S.
, and
Wulff
,
F.
, 1998, “
Intermetallic Growth in Small Ball Bonds
,”
Proceedings of the SEMICON Singapore, Test, Assembly and Packaging
, pp.
267
272
.
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