A successive initiation finite element modeling approach is presented in which an empirical continuum damage model, energy partitioning damage evolution model, developed by the author is used to update state of damage and constitutive properties of the material under thermomechanical cyclic loading and accumulate damage in the elements. Plastic and viscoplastic damages are evaluated based on the plastic and viscoplastic work densities obtained through finite element. Constitutive properties are updated elementwise at each step of the process based on the state of damage in each element. The elements that have reached the damage threshold are removed from the structure to initiate and propagate fatigue crack. This successive initiation approach is used to model crack initiation and propagation in Pb-free solder material under thermomechanical loading. A case study is presented, damage propagation path and pattern are compared with typical experimental results, and the accuracy of the model was verified.
Issue Section:
Research Papers
1.
Ritchie
, R. O.
, 1999, “Mechanisms of Fatigue-Crack Propagation in Ductile and Brittle Solids
,” Int. J. Fract.
0376-9429, 100
, pp. 55
–83
.2.
Ritchie
, R. O.
, and Dauskardt
, R. H.
, 1991, “Cyclic Fatigue of Ceramics: A Fracture Mechanics Approach to Subcritical Crack Growth and Life Prediction
,” J. Ceram. Soc. Jpn.
0914-5400, 99
(10
), pp. 1047
–1062
.3.
Suresh
, S.
, 1998, Fatigue of Materials
, 2nd ed., Cambridge University Press
, Cambridge, UK
.4.
Paris
, P. C.
, and Erdogan
, F.
, 1963, “A Critical Analysis of Crack Propagation Laws
,” ASME J. Basic Eng.
0021-9223, 85
(4
), pp. 528
–534
.5.
Rabotnov
, Y.
, 1968, “Creep Rupture
,” Proceedings of the 12th International Congress of Applied Mechanics
, Stanford, Aug. 26–31, M.
Hetenyi
and W.
Vincenti
, eds., Springer-Verlag
, Berlin
, pp. 342
–349
.6.
Kachanov
, L. M.
, 1986, Introduction to Continuum Damage Mechanics
, Martin Nijhoff
, Dordrecht, The Netherlands
.7.
Tanaka
, K.
, 1987, “Mechanisms and Mechanics of Short Fatigue Crack Propagation
,” JSME Int. J.
0913-185X, 1
(30
), pp. 1
–13
.8.
Chaboche
, J. L.
, and Lesne
, P. M.
, 1988, “A Non-Linear Continuous Fatigue Damage Model
,” Fatigue Fract. Eng. Mater. Struct.
8756-758X, 11
, pp. 1
–17
.9.
Lemaitre
, J.
, and Chaboche
, J. L.
, 1987, “Mecanique des mateiaux solide
,” Mechanics of Solid Materials
, Springer-Verlag
, Berlin
.10.
Kracinovic
, D.
, 1998, “Damage Mechanics
,” Meccanica
0025-6455, 33
(1
), pp. 105
–110
.11.
Basaran
, C.
, and Tang
, H.
, 2002, “Implementation of a Thermodynamic Framework for Damage Mechanics of Solder Interconnects in Microelectronics Packaging
,” Int. J. Damage Mech.
1056-7895, 11
(1
), pp. 87
–108
.12.
Kachanov
, L. M.
, 1958, “Time of the Rupture Process Under Creep Conditions
,” Izv. Akad. Nauk SSSR, Otd. Tekh. Nauk.
0367-679X, 8
, pp. 26
–31
.13.
Dasgupta
, A.
, Oyan
, C.
, Barker
, D.
, and Pecht
, M.
, 1992, “Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach
,” ASME J. Electron. Packag.
1043-7398, 114
(2
), pp. 152
–160
.14.
Ladani
, L. J.
, and Dasgupta
, A.
, 2009, “A Meso-Scale Damage Evolution Model for Cyclic Fatigue of Viscoplastic Materials
,” Int. J. Fatigue
0142-1123, 31
, pp. 703
–711
.15.
Ladani
, L. J.
, and Razmi
, J.
, 2009, “An Anisotropic Mechanical Fatigue Damage Evolution Model for PB-Free Solder Materials
,” Mech. Mater.
0167-6636, 41
, pp. 878
–885
.16.
Garofalo
, F.
, 1965, Fundamentals of Creep and Creep-Rupture in Metals
, Macmillan
, New York
.17.
Guo
, Z.
, and Conrad
, H.
, 1993, “Fatigue Crack Growth Rate in 63Sn37Pb Solder Joints
,” ASME J. Electron. Packag.
1043-7398, 115
(2
), pp. 159
–164
.18.
Wiese
, S.
, Feusetel
, F.
, Rzapka
, S.
, and Meusel
, E.
, 1999, “Creep and Crack Propagation in Flip Chip Sn-PB37 Solder Joints
,” IEEE ECTC Conference
, San Diego, CA, pp. 1015
–1020
.19.
Ju
, S. H.
, Sandor
, B. I.
, and Plesha
, M. E.
, 1996, “Life Prediction of Solder Joints by Damage and Fracture Mechanics
,” ASME J. Electron. Packag.
1043-7398, 118
, pp. 193
–200
.20.
Darveaux
, R.
, 2002, “Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction
,” ASME J. Electron. Packag.
1043-7398, 124
, pp. 147
–154
.21.
Darveaux
, R.
, 1993, “Crack Initiation and Growth in Surface Mount Solder Joints
,” Proceedings of the ISHM International Symposium on Microelectronics
, pp. 86
–97
.22.
Darveaux
, R.
, Banerji
, K.
, Mawer
, A.
, and Dody
, G.
, 1995, “Reliability of Plastic Ball Grid Array Assembly
,” Ball Grid Array Technology
, J.
Lau
, ed., McGraw-Hill
, New York
.23.
Darveaux
, R.
, 1997, “Solder Joint Fatigue Life Model
,” Design and Reliability of Solders and Solder Interconnections
, Orlando, FL, pp. 213
–218
.24.
Okura
, J. H.
, 2001, “Effect of Temperature and Moisture on Durability of Low Cost Flip Chip on Board (FCOB) Assemblies
,” Ph.D. thesis, University of Maryland, College Park, MD.25.
Ladani
, L. J.
, and Dasgupta
, A.
, 2008, “Damage Initiation and Propagation in Voided Joint: Modeling and Experiment
,” ASME J. Electron. Packag.
1043-7398, 130
, p. 011008
.26.
Zhang
, Q.
, 2004, “Isothermal Mechanical and Thermo-Mechanical Durability Characterization of Selected Pb-Free Solders
,” Ph.D. thesis, University of Maryland, College Park, MD.Copyright © 2010
by American Society of Mechanical Engineers
You do not currently have access to this content.
