The fatigue life of a material varies with the strain rate if it has time-dependent deformation. An interesting phenomenon related to the effect of the strain rate on the fatigue life can be observed when a cyclic tension-compression loading of which strain rate in the tensile region is different from that in the compressive region is employed for the fatigue test. Different fatigue lives due to different strain rates in the tensile and compression regions originate from the difference of development behaviors of creep strain generated in the cyclic loading. This paper investigates the effects of creep strain on the difference of fatigue life due to the different strain rate in the tensile and compression regions. The creep strain of the lead-free solder Sn–3.0Ag–0.5Cu subjected to a cyclic loading was investigated using stepped ramp wave loading. The experimental results reveal that the creep strain develops differently in the tensile and compression regions. A new parameter is proposed for estimating fatigue life when the strain rate varies in the loading direction.
Skip Nav Destination
e-mail: ken@ipc.akita-u.ac.jp
Article navigation
December 2010
Research Papers
Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves
Ken-ichi Ohguchi,
Ken-ichi Ohguchi
Department of Materials Science and Engineering,
e-mail: ken@ipc.akita-u.ac.jp
Akita University
, Tegatagakuen-cho 1-1, Akita 010-8502, Japan
Search for other works by this author on:
Katsuhiko Sasaki
Katsuhiko Sasaki
Division of Human Mechanical Systems and Design,
Hokkaido University
, N13, W8, Kita-ku, Sapporo 060-8628, Japan
Search for other works by this author on:
Ken-ichi Ohguchi
Department of Materials Science and Engineering,
Akita University
, Tegatagakuen-cho 1-1, Akita 010-8502, Japane-mail: ken@ipc.akita-u.ac.jp
Katsuhiko Sasaki
Division of Human Mechanical Systems and Design,
Hokkaido University
, N13, W8, Kita-ku, Sapporo 060-8628, JapanJ. Electron. Packag. Dec 2010, 132(4): 041010 (7 pages)
Published Online: December 3, 2010
Article history
Received:
December 13, 2009
Revised:
September 14, 2010
Online:
December 3, 2010
Published:
December 3, 2010
Citation
Ohguchi, K., and Sasaki, K. (December 3, 2010). "Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves." ASME. J. Electron. Packag. December 2010; 132(4): 041010. https://doi.org/10.1115/1.4002911
Download citation file:
Get Email Alerts
Cited By
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
J. Electron. Packag (December 2024)
Related Articles
Isothermal Cyclic Bend Fatigue Test Method for Lead-Free Solder Joints
J. Electron. Packag (December,2007)
Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test
J. Electron. Packag (June,2009)
Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves
J. Electron. Packag (December,2010)
Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch
J. Electron. Packag (December,2002)
Related Proceedings Papers
Related Chapters
Polycrystalline Simulations of In-Reactor Deformation of Zircaloy-4 Cladding Tubes during Nominal Operating Conditions
Zirconium in the Nuclear Industry: 20th International Symposium
Creep-Fatigue Behavior in High Strength Copper Alloys
Effects of Radiation on Materials: 22nd Symposium
Basic Concepts
Design & Analysis of ASME Boiler and Pressure Vessel Components in the Creep Range