This paper investigates the application of a Taguchi method to reduce warpage problem dealing with process parameters during production of bonding sheets. For this purpose, analysis was carried out by utilizing a combination of process parameters based on a two-level Taguchi orthogonal design. The signal-to-noise and the analysis of variance are used to find the optimum levels and to indicate the impact of the process parameters on warpage. The results show that the method can reduce warpage by about 94%, and a verification test is also conducted to prove its effectiveness after the optimum levels of process parameters are determined. It can thus be concluded that this Taguchi method is suitable to solve the quality problems that occur due to warpage.
Application of a Taguchi Method Technique in Determining the Laminating Process Parameters for a Bonding Sheet
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Yen, Y., Fang, T., and Lin, Y. (November 24, 2010). "Application of a Taguchi Method Technique in Determining the Laminating Process Parameters for a Bonding Sheet." ASME. J. Electron. Packag. December 2010; 132(4): 041005. https://doi.org/10.1115/1.4002723
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