Testing the thermal properties of thermal interface material (TIM) has been a big challenge for decades. Recent development trends made this challenge even bigger, as now the values that have to be measured are extremely small. In this paper, we present a newly developed TIM tester equipment that is targeting to overcome all the problems that present industrial TIM testing methods face. The main idea behind our design is to use the capabilities of microelectronics in order to make small sized sensors both for temperature and heat-flux sensings. This way it is possible to place these sensors in the closest proximity of the measured sample. This paper presents details of all the technical solutions of the newly developed static TIM tester that is capable to measure Rth of unit area values in the order of 0.01Kcm2/W with good accuracy. Special attention is made to analyze and eliminate the possible sources of measurement inaccuracy. A number of measurement examples prove the usability of the developed measuring instrument.

1.
2001, “
Standard Test Method for Thermal Transmission Properties of Thin Thermally Conductive Solid Electrical Insulation Materials
,” ASTM Paper No. D 5470-01.
2.
Lasance
,
C. J. M.
,
Murray
,
C. T.
,
Saums
,
D. L.
, and
Rencz
,
M.
, 2006, “
Challenges in Thermal Interface Material Testing
,”
Proceedings of the 22th IEEE SEMI-THERM Symposium
, pp.
42
49
.
3.
Hanson
,
K.
, 2006, “
ASTM D 5470 TIM Material Testing
,”
Proceedings of the 22th IEEE SEMI-THERM Symposium
, pp.
50
53
.
4.
Zhang
,
K.
,
Yuen
,
M. M. F.
,
Wang
,
N.
,
Miao
,
J. Y.
,
Xiao
,
D. G. W.
, and
Fan
,
H. B.
, 2006, “
Thermal Interface Material With Aligned CNT and Its Application in HB-LED Packaging
,”
Proceedings of the IEEE Electronic Components and Technology Conference
, pp.
177
182
.
5.
Jarrett
,
R. N.
,
Merritt
,
C. K.
,
Ross
,
J. P.
, and
Hisert
,
J.
, 2007, “
Comparison of Test Methods for High Performance Thermal Interface Materials
,”
Proceedings of the 23th IEEE SEMI-THERM Symposium
, pp.
83
86
.
6.
Keams
,
D.
, 2003, “
Improving Accuracy and Flexibility of ASTM D 5470 for High Performance Thermal Interface Materials
,”
Proceedings of the 19th IEEE SEMI-THERM Symposium
.
7.
Bosch
,
E.
, and
Lasance
,
C.
, 2000, “
High Accuracy Thermal Interface Measurement of Interface Thermal Resistance
,”
Electronics Cooling
,
6
, pp.
26
32
.
8.
NanoPack Interim Report No. Wp 4.
9.
Rencz
,
M.
,
Kollár
,
E.
, and
Székely
,
V.
, 2004, “
Heat Flux Sensor to Support Transient Thermal Characterisation of IC Packages
,”
Sens. Actuators, A
0924-4247,
116
(
2
), pp.
284
292
.
10.
2007, NanoPack Project of the European Union, No. 216176/2007.
You do not currently have access to this content.