This study examines the refrigerant distribution of a dual cold-plate system subject to the influence of heating load, using a R-134a based vapor compression system with a nominal capacity ranging from 50 W to 250 W. The cold plate is of identical configuration. Initially, test is performed under an equal heating load for each cold plate (70 W), which then gives rise to a uniform distribution and equal outlet superheat condition. For an unequal heating load, it is found that the distribution of mass flowrate subject to the influence of heating load is strongly related to the outlet states of the two cold plates. For the condition where one of the cold plates is in superheated state while the other is in saturated state, the mass flowrate for the fixed heating load is lower than that of smaller heating load, and the difference increases when the heating load gets smaller due to the influence of accelerational pressure drop. A maximum of 17% difference is seen at a loading ratio of 0.571 (40 W/70 W). For the condition where both outlet states of the cold plate are at superheated states, the mass flowrate for the fixed heating load is marginally higher than that of the smaller heating load, and the difference is insensitive to the increase in heating load. For this situation, the effect of accelerational pressure is negligible, and it is mainly attributed to two-phase/single-phase distribution pertaining to the effect of heating load.

1.
Trutassanawin
,
S.
,
Groll
,
E. A.
,
Garimella
,
S. V.
, and
Cremaschi
,
L.
, 2006, “
Experimental Investigation of a Miniature-Scale Refrigeration System for Electronics Cooling
,”
IEEE Trans. Compon. Packag. Technol.
,
29
, pp.
678
687
. 1521-3331
2.
Phelan
,
P. E.
, 2001, “
Current and Future Miniature Refrigeration Cooling Technologies for High Power Microelectronics
,”
Proceedings of the Semiconductor Thermal Measurement Management Symposium
, San Jose, CA, Mar. 20–22, pp.
158
167
.
3.
Schmidt
,
R. R.
, and
Notohardjono
,
B. D.
, 2002, “
High-End Server Low-Temperature Cooling
,”
IBM J. Res. Develop.
,
46
, pp.
739
751
. 0018-8646
4.
Peeples
,
J. W.
, 2001, “
Vapor Compression Cooling for High Performance Applications
,”
Electron. Cooling
,
7
, pp.
16
24
, http://www.electronics-cooling.com/index.phphttp://www.electronics-cooling.com/index.php.
5.
Phelan
,
P. E.
, and
Swanson
,
J.
, 2004, “
Designing a Mesoscale Vapor-Compression Refrigerator for Cooling High-Power Microelectronic
,”
Proceedings of the Intersociety Conference on Thermal and Themomechanical Phenomena in Electronic Systems (I-THERM)
, Las Vegas, NV, Jun. 1–4, pp.
218
223
.
6.
Nnann
,
A. G. A.
, 2006, “
Application of Refrigeration System in Electronics Cooling
,”
Appl. Therm. Eng.
,
26
, pp.
18
27
. 1359-4311
7.
Collier
,
J. G.
, and
Thome
,
J. R.
, 1994,
Convective Boiling and Condensation
,
3rd ed.
,
Oxford University
,
New York
.
You do not currently have access to this content.