Electronics packaging design is a process that requires optimized solutions based on multidisciplinary design trade-offs, which usually have complex relationships among multiple design variables. Required numerical analyses combining electrical, thermal, and thermomechanical, among others, have made the multidisciplinary design and optimization process more challenging because of their time-intensive modeling and computation. In this paper, a state-of-the-art review of recent multidisciplinary design and optimization methodologies in electronics packaging is presented. The reported methodologies are divided into three groups: (1) integrated multidisciplinary computer aided design (CAD) environment, (2) semi-automated design optimization techniques, and (3) automated component placement techniques. In the first group, multidisciplinary design and optimization are carried out using interactive CAD environment software. The electronics packaging designer inputs data and makes decisions, while the CAD software provides a comprehensive multidisciplinary modeling and simulation environment. In the second group, using semi-automated design optimization methodologies, various objectives are optimized simultaneously mainly based on package configurations (dimensions), material properties, and operating conditions. In the third group, optimal placement of heat generating components is performed automatically based on multiple requirements. In recent years, methodologies using (1) detailed numerical analysis models directly connected to optimization algorithms, (2) design of experiments (DoE), and (3) artificial neural networks (ANNs) have been proposed as new trends in this field. These methodologies have led to significant improvement in design optimization capabilities, while they require intensive computational effort. Advantages as well as disadvantages of these methods are discussed.
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e-mail: ahadim@stevens.edu
e-mail: tsuwa@stevens.edu
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September 2008
Technology Review
Multidisciplinary Design and Optimization Methodologies in Electronics Packaging: State-of-the-Art Review
Hamid Hadim,
Hamid Hadim
Associate Professor
Department of Mechanical Engineering,
e-mail: ahadim@stevens.edu
Stevens Institute of Technology
, Hoboken, NJ 07030
Search for other works by this author on:
Tohru Suwa
Tohru Suwa
Department of Mechanical Engineering,
e-mail: tsuwa@stevens.edu
Stevens Institute of Technology
, Hoboken, NJ 07030
Search for other works by this author on:
Hamid Hadim
Associate Professor
Department of Mechanical Engineering,
Stevens Institute of Technology
, Hoboken, NJ 07030e-mail: ahadim@stevens.edu
Tohru Suwa
Department of Mechanical Engineering,
Stevens Institute of Technology
, Hoboken, NJ 07030e-mail: tsuwa@stevens.edu
J. Electron. Packag. Sep 2008, 130(3): 034001 (10 pages)
Published Online: July 30, 2008
Article history
Received:
June 5, 2007
Revised:
December 6, 2007
Published:
July 30, 2008
Citation
Hadim, H., and Suwa, T. (July 30, 2008). "Multidisciplinary Design and Optimization Methodologies in Electronics Packaging: State-of-the-Art Review." ASME. J. Electron. Packag. September 2008; 130(3): 034001. https://doi.org/10.1115/1.2957459
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